-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
From the Show: Head-in-pillow Defects Presentation
March 31, 2009 |Estimated reading time: Less than a minute
LAS VEGAS Soldering defects are immensely important to electronics assemblers, particularly those in high-reliability industries. Today at the APEX technical conference, Indium's Mario Scalzo will present on head-in-pillow defects.
Scalzo, senior technical support engineer, authored "Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly," which discusses the two main sources of head-in-pillow defects and solutions for their elimination.
The presentation will take place today, March 31, from 1:30 to 3:00pm.
To see an image of head in pillow, read editor Gail Flower's Solder Paste Basics: A Round-up.
For more information, or to view the schedule of events, visit www.goipcshows.org, or read IPC APEX Expo Preview: Innovative Technology Center, Task Groups, and MoreIPC APEX Expo Preview: Technical Courses and TutorialsGet Ready for APEX: Preview of Technical Sessions and Noteworthy Events