-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Heraeus Intros No-clean Tin/lead Solder Paste
February 10, 2009 |Estimated reading time: Less than a minute
WEST CONSHOHOCKEN, PA Heraeus released a tin/lead solder paste, F377, the result of a two-year development cycle that employed early customer involvement and design for Six Sigma tools. Formulated as a completely new platform, F377 surpasses performance benchmarks by using modern raw materials statistically proven in real-world testing to produce the most desirable and stable results.
This is an improvement over other tin/lead solder paste options, most of which were formulated in the last decade and use older materials technologies that induce lot-to-lot performance variations, according to Heraeus. The F377 product's production performance cannot be influenced by naturally occurring variations in raw materials. This generates stability in both print and reflow processes.
For more information, visit heraeus-contactmaterials.com.