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New Products: Connectors, Programming Scripts, Pastes, and More
December 31, 1969 |Estimated reading time: 5 minutes
Following are recently introduced products from power semiconductor lead-free solder paste to flex-to-PCB connectors, to hot bar or pulse soldering systems, and more.
High-speed Mezzanine ConnectorThe IT3 Series mezzanine connector is a three-piece modular system targeting easier assembly, reliable X-ray inspection, better reflow performance, and higher production yield between two parallel PC boards, without sacrificing overall connector performance. This new-generation high-density board-to-board connector family provides two board-mounted receptacles of the same low profile and a variable height interposer to accommodate different board spacing requirements. It is designed to simplify automated reflow assembly processing, which the company claims reduces solder joint failure and increases production yields. The two low-profile receptacles mounted to each parallel PCB have BGA solder balls mounted in a staggered array of 1.5 × 1.75 mm pitch. The floating interposer module reportedly reduces the possibility of mechanical damage to the BGA joints. The series is compatible with industry-standard footprints, available in 100-, 200-, and 300-position modules, with interposers for board stack heights from 15 to 40 mm. They are rated at 50 ohm single-ended impedance and 100 ohm differential impedance. BGA solder balls are available in standard eutectic tin/lead or lead-free (SAC). IT3 Series connectors are qualified to EIA-364-1000 for environmental performance and IPC-9701 for long-term solder joint reliability. Hirose Electric Co. Ltd., www.hiroseusa.com.
Manufacturing ManagementagileFMS Factory & Manufacturing Solution is a jointly developed product that offers practical implementations of advanced business and technology theories. Such implementations reportedly yield successful strategy and execution of manufacturing efficiency and optimization efforts for clients worldwide. The services are designed to modify work-in-progress (WIP), maximizing throughput, minimizing cycle time, and reducing cost within factory-specific environments across multiple industries. Included within the agileFMS processes are Manufacturing Process Analysis; Factory Modeling, which finds areas for immediate and sustainable cost reduction; Operational Optimization to increase work efficiency and improve cycle time; and Monitoring & Continuous Improvement. Results released by the companies include reduced ROI timeline, over 60% reduction in both cycle time and scrap/rework (respectively) within six months, and net profitability doubling within twelve months. agileTCP and Innovo Strategy, www.agiletcp.com.
Benchtop Fluid Dispensing Product GuideThe "Bench Top Fluid Dispensing Product Guide" includes dispensers, 700 Series consumables, and dispensing tip options. Some of the entry-level dispensers included in the most recent guide include the TS250 and TS255 Digital Dispensers, suiting general dispensing applications and low viscosity fluids, respectively. The guide also features advanced digital dispensers TS350 and TS355, for a wide range of fluid viscosities and low-viscosity fluids, respectively. Featured 700 Series consumables include the receiver head assembly, end caps, air powered pistons, syringes, syringe assembly kits, and tip caps double helix thread. Dispensing tip options include the TE Series Tips, TE Series Bent Tips, TT Tips, TS-P Plastic Tips, and Brush Tips. The dispensing systems can be accessorized with a finger switch assembly, syringe holders, a vacuum pencil and control unit, a manual syringe gun, a dispensing tip kit, and a foot valve dispenser. Applications include heatsink compound, surface mount adhesive (SMA), grease, solder paste, flux, silicon, anaerobic, and needle color-coding. Techcon Systems, a product group of OK International, www.techconsystems.com.
Power Semiconductor Lead-free Solder PasteSN100C P800 D2 power semiconductor lead-free solder paste is a high-reliability paste for device assembly that reportedly reduces voiding and reflow time. The company asserts that SN100C P800 shortens reflow cycle times and increases wettability. The paste targets improved high-speed printability, even for large apertures. The lead-free paste prevents shrinkage cavities and IMC growth, without shrinkage defects. The paste is marketed as a cost-effective, RoHS-compliant alloy with high-impact strength. Nihon Superior Co. Ltd., www.nihonsuperior.co.jp.
The two pulse bonders from Manncorp.Hot Bar Soldering Systems Hot bar soldering systems are designed to bond unlikely materials to PCBs, including flex circuits, ribbon cables, wires, edge connectors, etc. The series of semi-automatic pulse bonders or hot bar solder machines employ thermode technology to generate rapid reflow by pulse heating. Materials with low temperature resistance can be soldered at lead-free-compatible high temperatures without damage. The PBS212 system offers an in/out shuttle that moves processing linearly, while system PBS213 uses an in/out 180° rotating table. Both machines perform the bonding process automatically and exit without operator intervention. All elements of the soldering profile are programmable, including pressure, temperature, and heat-up and cool-down times. Processing duration ranges 12 to 15 seconds. Manncorp, www.manncorp.com.
SMT Placement Programming ScriptsA method for creating complex SMT placement programs for PCB assembly, this set of automated scripts runs within the GerbTool/VisualCAM software suites and are compatible with many Mentor, Cadence, and ESI PCB design packages. GerbTool scripts are automated macro programs that run within the GerbTool shell. They are assigned and called up through the user menu; the programming environment is visual. The scripts provide a simple alternative to manual programming methods, wherein the end user creates simple off-line programming from their data sets. The system works by grabbing component by component, after which the script will automatically find the centroid. Once the reference and rotation information has been added, full spreadsheet files can be exported. The script includes a full Component Edit facility and editing features include search, and component highlighting on screen. The script can easily be configured to match existing format requirements, and supports both metric and imperial codes. VisualCAM users can also take advantage of these scripts as an entry-level alternative to the ARE (Automated Reverse Engineering) modules that allow full SMT/BOM capabilities. WISE Software Solutions Inc., www.wssi.com, provides the GerbTool and VisualCAM software. JD Photo-Tools, www.jdphoto.co.uk.
Copper Flex-to-PCB InterposerA flexible copper high-density/high-speed interposer, the FlexBeam is a tool-less configuration designed for ease of use. The low-profile, flex-to-board interface provides densities of 1.00 mm or less in a variety of pin-matrix configurations. The FlexBeam comprises a high-speed copper flex assembly integrated with HD&S PCBeam interposer. It suits server, mass storage, medical imaging, automatic test equipment (ATE), military command and control center, as well as the military munitions applications. The interposer features all-metal spring beams permanently embedded onto an FR-4 substrate, adding a third dimension (z-axis) in a high-density configuration. A photolithography and etch-based manufacturing process allows dimensional control and scalablity to fine feature sizes. Typical configurations provide 0.152-mm mechanical compliance per side at 1.00-mm pitch. A dual-beam option is also available to provide contact redundancy in high-reliability applications. The integrated copper flex assembly with PCBeam interposer allows differential signal speeds of greater than 10 Gbit/sec. and single-ended speeds of 4 GHz and higher, with cross talk of less than 3% in a pin-matrix configuration. The copper flex assembly will provide the contact configuration to allow for board-to-flex pin counts of 500 input/outputs or greater. Molex Incorporated and Neoconix, www.molex.com and www.neoconix.com.