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SMTA Calls for SMTAI, IWLPC, and Other Conference Presenters
January 12, 2009 |Estimated reading time: Less than a minute
MINNEAPOLIS The Surface Mount Technology Association (SMTA) is accepting abstracts for several of its 2009 technical and educational programs, including The International Conference on Soldering & Reliability, the AIMS Harsh Environment Electronics Symposium, SMTA International (SMTAI), and the International Wafer-Level Packaging Conference (IWLPC).
To submit an abstract for The International Conference on Soldering & Reliability, visit www.smta.org/education/education.cfm#toronto. Abstracts are due January 16, 2009. Contact Melissa Serres Marx at melissa@smta.org to request an extension.
If you are interested in presenting at the AIMS Harsh Environment Electronics Symposium, submit an abstract by March 27, 2009. To submit, visit http://www.smta.org/education/education.cfm#aims.To be considered for the SMTA International Conference, submit an abstract by March 27, 2009, at http://www.smta.org/smtai/call_for_papers.cfm.
Finally, to submit an abstract for the International Wafer-Level Packaging Conference, visit http://www.iwlpc.com/call_for_papers.cfm. Abstracts must be submitted by March 17, 2009.
Each conference's Website provides a complete call for abstracts with suggested topics and areas of interest, as well as rules of submission.