-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Seika Intros SAWA Ultrasonic Stencil Cleaner
November 11, 2008 |Estimated reading time: Less than a minute
TORRANCE, Calif. Seika Machinery Inc. launched the SC-5000 tabletop ultrasonic stencil and misprint cleaner as part of its SAWA platform of products. The system features cleaning head, generator, foot pedal, 32 × 32" tray and 30 foam pads.
The SAWA 5000GUS removes solder balls from stencil apertures after normal wipe cleaning. A handheld ultrasonic cleaning head is applied manually over apertures with any solvent. During application of the cleaning head, the stencil is laid on a foam pad soaked with solvent contained within a large tray. The foam is used to capture solder balls dislodged by the cleaning head. A similar method is utilized for cleaning misprinted bare boards.
SAWA ultrasonic systems reportedly are environmentally friendly, fast, safe, economical, and effective for fine-pitch stencil cleaning. SAWA cleaner evaluations and product details are available on the company's Website.
For more information, visit www.seikausa.com.