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Christopher Associates Releases HDI Market Data
October 13, 2008 |Estimated reading time: Less than a minute
SANTA ANA, Calif. Matthew Holzmann, president of Christopher Associates Inc., presented the keynote address to the IPC's HDI Technology Conference in Dallas, Texas, on the demand for high-density interconnect substrates in North America. With assistance from multiple sources, including Prismark Partners, Holzmann outlined existing and potential markets as well as current market conditions for these products. The major points of Holzmann's keynote are summarized here.
HDI is used in a range of end products, including cell phones, packaging substrates, ink jet printer cartridge heads, Bluetooth devices, aerospace systems, and medical electronics. It offers significant technical and economic advantages over conventionally designed and manufactured PCBs in many applications, and is gaining market share in industries including automotive, telecommunications, and military electronics, with over 80% of current demand filled from overseas sources.
Copies of the presentation can be downloaded at www.christopherweb.com. Contact the author at matt.holzmann@christopherweb.com.