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Events around the Industry
December 31, 1969 |Estimated reading time: 2 minutes
Newark will host an online networking and educational event on energy-efficient electronics; SMTA released the final program for Pan Pac 2009; and IPC announced an all-academic poster competition to take place at IPC APEX EXPO.
In conjunction with its Live Edge global environmental design competition, Newark is hosting a series of events in its virtual Live EDGE EcoSphere community. "Designing with Energy Efficiency & More," the first event, will be held October 15 at 8 AM EST. The virtual learning and social networking event will showcase next-generation energy-efficiency technologies. Attendees can download technical information and chat live with 27 reps of component manufacturers and other colleagues. Register at www.tisecosystem.com/liveedgeecosphere.
Registration is open and the program is finalized for the 14th annual Pan Pacific Microelectronics Symposium & Exhibit, February 1012, 2009 at the Hapuna Beach Prince Hotel on the Big Island of Hawaii. Pan Pac's conference promotes international technical interchange, comprising sessions on environmental sensitivity, market directions and trends, solderability and reliability, logistics and prognostics, test and measurement, high frequency, 3D assembly, unusual soldering challenges, assembly strategies and processes, and lead-free solders and reliability. The technical program also will host sessions on second-level assembly, solder processing and rework, device packaging and new materials and deposition. Keynote presentations include "Cleaning Relevance in Electronics Assembly, the Value Proposition," by Thomas M. Forsythe and Michael L. Bixenman, Kyzen Corporation; and "High Tech Investing in Difficult Economic Times," by Mario Ferrario, Redifin Italy. Register at smta.org/panpac.
IPC Association Connecting Electronics Industries will host an all academic poster competition at IPC APEX EXPO for U.S. and international colleges and universities with a strong focus on the electronics industry, March 31 to April 2, 2009, in Las Vegas. The competition promotes academic research departments to international exposure and cash awards for their work. Abstracts of approximately 300 words must be received by December 1, 2008, and must be submitted on behalf of an accredited college or university. All accepted abstracts will be posted on the IPC APEX EXPO Website. Industry technologists worldwide will vote online for the best abstract based on innovation, timeliness of the work, and applicability to industry needs. The primary authors of the 15 top posters will each be awarded a $1,000 honorarium and invited to prominently display the poster at APEX. IPC will also provide hotel accommodations and a free technical conference registration. At the event, the top 15 posters will be on display on the show floor, where more than 13,000 key engineers, managers, and executives from all segments of the electronic interconnect community will vote for the top three. The winners will be announced at the closing keynote on Thursday, April 2, and awarded cash awards from $5,000 to $1,000. To participate, visit www.ipcapexexpo.org/academicposters or speak with Toya Richardson, IPC technical administrative assistant, at toyarichardson@ipc.org; (847) 597-2825.