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Sonoscan Announces Advanced Thickness Measurement Method
October 2, 2008 |Estimated reading time: 1 minute
ELK GROVE VILLAGE, Ill. In a joint effort with a large component supplier to the cellular and video industries, Sonoscan developed an acoustic micro imaging technique that accurately measures the thickness of the bondline of the heat spreader adhesive in advanced microprocessor assemblies. The technique remains effective when the bondline is too thin for individual echoes to be separated, according to the developers.
Internal thicknesses typically are measured by recording the time of an echo from the top of a layer and from the bottom of the same layer. The thickness of the bondline must be within a specific range (30 and 80 µ for example) to avoid a loss of heat dissipation and consequent electrical failure. These dimensions are too thin for the relatively low acoustic frequencies used to penetrate the metal heat spreader. The waveforms of the two echoes merge into a single echo.
The solution is to use one echo from the bondline itself and a second reference echo to extract the thickness measurements needed. This technique is used with Sonoscan's automated FACTS2 system, which carries trays of microprocessor assemblies. Bondline thickness measurements are taken at multiple points on each assembly to identify a process drift as soon as possible after attachment of the heat spreader.
For more information, see www.sonoscan.com.