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Review: BGA Breakouts & Routing
December 31, 1969 |Estimated reading time: 1 minute
BGA Breakouts & Routing, Effective Design Methods for Very Large BGAs, by Charles Pfeil, engineering director of Mentor Graphics’ Systems Design Division, tackles demonstrating design technology on a written page with abundant illustrations. The textbook suits those accustomed to receiving training through PowerPoint presentations, with data clearly segmented and related consistently to the illustrations. Pfeil wrote it to describe high-pin-count, dense BGAs and their relationship to PCB designs. Advanced PCB fabrication techniques, improved software, and integral design techniques can solve these design challenges. “My intent is to provide new ideas that enable increased route density while fulfilling signal integrity requirements. Two important methodology improvements stand out: using fanout via patterns that are aligned and using different via patterns in multiple regions. This first edition focuses on techniques and technologies applicable to any PCB design software.
The author argues that too little consideration is given to the BGA package’s impact on the PCB, and PCB designers must consider layer counts, assembly reliability, signal integrity, and other factors when laying out a new product incorporating dense BGAs. Jamming advanced, dense electronics onto standard FR-4 PCBs no longer is acceptable. “In the context of large BGAs, designers have to face the fundamental conflict between the continual miniaturization of device packaging and the slower adoption of fabrication capabilities that support smaller feature sizes. Companies have been slow to fabricate using high-density interconnect (HDI), forcing designers to try routing these dense devices with standard FR-4 boards and through-vias, which are relatively large,” Pfiel tells us, adding that boards with dense BGAs are very difficult to route and often end up costing more because of the additional layers required. The book provides justification for moving to HDI for all designs with BGAs.
Nepcon — From Boston to Southeastern Asia
The Nepcon series of shows are entering new territory in 2008, beyond established events like Nepcon China and Nepcon East. New locales point to the emerging importance of regions like India and Malaysia to the global electronics manufacturing industry. The company introduced two chapters of the Componex Nepcon series in Delhi and Chennai in 2008. Its Penang show was the largest in Malaysia to date. NEPCON Vietnam debuted this year to a receptive audience of more than 7,000. August wrapped with Nepcon South China in Shenzhen.