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SMTAI Product Preview
December 31, 1969 |Estimated reading time: 4 minutes
Following are the new product demonstrations and happenings that will be taking place at SMTAI, August 17 to 21, 2008, in Orlando, Fla. Equipment and material suppliers will be showcasing screen printers, lead-free solder pastes, soldering systems, test-and-inspection equipment, pick-and-place systems and chip shooters, adhesives, and more.
Inspection and Soldering SystemsChristopher Associates will debut a variety of inspection and assembly soldering products, including the Marantz iSpector AOI system designed to be field-upgradeable from benchtop to in-line capability. The Koh Young KY - 3020T benchtop solder paste inspection (SPI) system offers 100% inspection of all solder deposits at production speeds. Other products to be exhibited include the Japan Unix Model 414R robotic soldering system, and the new Koki Tec Taku Robo benchtop selective soldering system. The KDS-101 solder dross recovery system, developed by Koki Tec in cooperation with Sony Corporation, will launch. Other products on display include application-specific solder paste formulations from Koki. Christopher Associates Inc., www.christopherweb.com. Booth 803.
Advanced Stencil TechnologiesALPHA CUT, ALPHA NICKEL, and ALPHA FORM product lines will be displayed, as well as advanced stencil services, including Data Scaling. The company launched its "First-Time-Right" NPI Stencils Initiative for its ALPHA engineered products in 2008 to help electronics assemblers and prototyping houses reduce their NPI cycle times, improve first pass yields and enable new product assembly. Cookson Electronics Assembly Materials, www.cooksonelectronics.com. Booth 210.
The Horizon 01i printer.Printing TechnologiesThe Horizon 01i printing platform will showcase speed and precision with continuous, repeatable high-throughput production at 10 sec. cycle times. The printer suits high-mix or high-volume production environments and includes the Instinciv V9 interface and HawkEye 750 post-print verification technology. The system may also be configured with the Cyclone cleaning system. The system will be demonstrated with all options. The company also will perform live demonstrations of its VectorGuard stencil system, offering high tension control, enhanced operator safety, and reportedly easy foil changeover. From stainless steel to laser cut nickel to electroformed and platinum, VectorGuard foils are available in a wide variety of metals and finishes. DEK, www.dek.com. Booth 800.
Semiautomatic Stencil PrinterSP003-MLV semiautomatic stencil printer uses vision for faster control and alignment correction. It features new trans-stencil vision, a motorized print head, and vertical stencil separation. The printer accommodates stencils or screens up to 23 × 23". SP003-MLV controls squeegee pressure, angle of squeegee, print speed, stencil position, stencil separation after printing, and other printing parameters. Print alignment is accomplished by clearance-free, fine-pitch thread screws, and other print parameters can be adjusted on the front panel. The stencil printer is available with different print mounts: vacuum, groove, flat, or magnetic tables. The magnetic table is used mostly with single- and double-sided boards. SP003-MLV suits small- and medium-volume production. It is designed for stencil printing, screen printing, print/print, print/flood, and flood/print.. Essemtec, www.essemtec.com. Booth 211.
Interactive SessionAttendees can meet Indium's bloggers on the show floor, August 20 at 11 AM, during the "Meet the Bloggers" session. Technology experts will lead discussions on topics including halogen-free, RoHS and Greenpeace, lead-free compliance, REACH, silver content in solders, head-in-pillow defects, next-generation solder alloys, and dopants. Indium personnel who will be discussing these topics include Dr. Ronald Lasky, Amanda Hartnett, Tim Jensen, Anny Zhang, and Rick Short. All attendees are welcome to participate in, or observe the session. Refreshments will be served. Indium Corporation, www.indium.com. Booth 517.
ATE and Assembly Equipment and MaterialsSeika Machinery will exhibit technology in surface mount and ATE solutions available from various suppliers. The CKD 3D in-line solder paste inspection (SPI) system, Model VP5000, will be shown with Young Jin conveyor system. The model includes SPC in real time. It is optimized for fast inspection of lead-free solder printing. SAYAKA PCB routers provide precise depanelization of high-volume and densely populated PCBs. User-friendly software provides point-and-click operation for programming cutting paths. The Hioki flying probe ICT system inspects solder joint integrity with electrical conductivity using terminal probes and AOI to provide fast and accurate inspection of mounted PCBs at 40 steps per second. With 17,000× magnification, standard integrated lighting, and rotational 3D imaging, the Hirox KH-7700 3D digital video microscope system inspects solder joints on QFPs and other components for bridging, poor wetting, alignment, or other defects in real time and captured for documentation. An additional camera probe enables BGA inspection. The company also will feature the MCDRY ultra-low-humidity IC package storage cabinets, including the ergonomic feeder model and a low-temperature baking cabinet. It will display the Nihon Superior SN100 lead-free solder materials. Seika Machinery Inc., www.seikausa.com. Booth 617.
AOI and X-ray Inspection SystemsThe YTV F1 AOI system and the X3 3D X-ray inspection system include upgrades and new-generation features. The YTV F1 AOI system provides advanced inspection of solder and lead defects, component presence and position, correct part, polarity and thru-hole parts. The F1 suits high-volume/high-mix manufacturing environments and helps increase throughput, improve quality, and reduce costs. It targets pre- and post-reflow applications. Four advanced oblique viewing cameras offer R-nets and other difficult- parts inspection. Fusion Lighting, with multi-color solder joint inspection, delivers 20% higher detection capabilities. The F1 offers off-line programming and a standard package library to simplify training and program portability. Real-time SPC monitoring optional. X-series AXI offers advanced 3D inspection of PCBs with BGAs and other hidden solder joints. The X3's proprietary imaging technology rapidly gathers multiple oblique images of the sample to help identify solder- and component-related defects on single- and double-sided boards. The X3 can selectively use 2D or 3D technology to inspect specific regions of interest. YESTech, www.yestechinc.com. Booth 216.
For more SMTAI products, check out our August SMTAI preview.