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New SMT Assembly Products
December 31, 1969 |Estimated reading time: 3 minutes
High-rel Lead-free CapacitorsAVX Corporation developed a family of fused tantalum capacitors that feature an internal fuse to protect against short circuits and damaging high-DC leakage currents. Designated the TAW Series, the tantalum capacitor will remove itself from the circuit and enter 'fail safe' mode when the internal fuse exceeds the current limit. The rugged TAW fused tantalum capacitor provides high capacitance values, up to 10 M?, and low equivalent series resistance (ESR) for high-reliability applications including aerospace, automotive, servers, and telecoms infrastructure products. Unlike conventional devices that incorporate an embedded lead wire fuse, the TAW tantalum capacitor series is lead-free and RoHS-compliant. www.avx.com.
MSD StorageXDry Inc. introduced a line of dry cabinet storage systems in various standard styles and sizes from 5 to 50 cubic feet of storage space, with an effective operating range from 0.5% to 50% relative humidity (RH), designed to satisfy virtually every moisture control requirement. Dry cabinets provide a consistent environment within a specific relative humidity removing moisture from components and boards. Removing moisture prevents stretch and shrink of board dimensions allowing for more accurate placements, and prevents explosive water out-gassing during the reflow process. www.xdry.com.
Conformal CoatingTechspray's Turbo-Coat acrylic conformal coating is designed to speed up board production throughput without additional investment in UV systems or other capital equipment. Turbo-Coat dries tack-free in 3 minutes. Full cure can be achieved as quickly as 10 minutes with elevated temperatures. Turbo-Coat can be either sprayed or brushed, or boards can be dipped directly into the coating for a thicker layer of protection. It offers reportedly easy and fast rework-and-repair and is IPC-CC-830 & MIL-I-46058C tested. The coating is UL94 V-0 rated and dries clear. It has a UV indicator for black light QC Inspection. www.techspray.com.
Package Stacking SolderCookson Electronics launched ALPHA POP-959 lead-free, no-clean solder paste designed to deliver highly repeatable paste volumes for challenging PoP assembly, thus increasing throughput and yield while minimizing expensive rework and scrap. The solder paste provides flux and solder powder, to help minimize defects associated with non-planar processor/memory combinations during the reflow process. The use of paste is said to help reduce defects associated with soldering known good memory devices to known good processor packages by bridging gaps that PoP flux alone may not. The paste boasts resistance to shear forces associated with PoP dip application equipment. ALPHA PoP 959 maintains rheology under frequent exposure to high shear for at least 24 hours. It suits 150 to 300 µm offset chipscale packages (CSPs) and leaves colorless residue with high electrical resistivity. www.cooksonelectronics.com.
Desktop AOIFocalSpot Inc. released a scanner-based optical inspection system. The FA-Inspector suits first article build-to-BOM validation prior to line release for PCB assemblies. It uses a high-resolution scanner and computer-based image processor to provide image acquisition, fault identification, and SPC reporting. The scanner incorporates proprietary optics, custom illumination, and runs advanced AOI software. Board handling is up to 19 × 24" with an 11 × 16" inspection area. It detects defects on SMT and thru-hole devices down to 0402, including part absence, polarity, and pin orientation. AOI mode allows inspection routines to be taught once and run many times semi-automatically, without programming. Comparator mode uses a golden board as test reference. Faults are classified and logged in real-time by the operator. Both modes generate fault reports for easy rework. www.focalspot.com.
Water-soluble Solder PasteFCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.'s SN100C product line, premiered the WS170 water-soluble solder paste. WS170 is a second-generation paste chemistry for Sn62/Sn63 applications. It was developed to sustain optimal performance throughout a wide spectrum of environmental conditions. WS170 produces wetted, shiny solder joints, and has the activity necessary to solder to common hard-to-wet alloys such as gold, platinum, palladium, silver, alloy-42, and bare copper. Its intrinsic sheer characteristics provide good paste roll and a full aperture fill during the print cycle. The paste is said to leave crisp paste deposits and no clogged stencils. Print speeds of up to 6"/sec have been tested with full aperture fill and no slumping. Benefits of the paste include non-hygroscopic formulation, broad process window, 24-hour stencil life and tack time, minimal to no foam when cleaned, easy-to-clean post-process residues, repeatable paste deposition, and more. www.fctassembly.com.