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VJ Electronix Hosts Educational Open House
December 31, 1969 |Estimated reading time: 6 minutes
The theme of VJ Electronix’s open house in Littleton, Mass., was the power of knowledge. Operator knowledge can transform quality rework tools and X–ray machines into useful, powerful performers in the electronics manufacturing facility. Presenters Mark Walz, product manager, Summit Rework Systems and Frank Cosentino, special systems and business development, brought up pressing problems in rework and inspection tasks, and offered tips, background information, and process data to help overcome complex obstacles.
If you can’t rework a high–tech PCB assembly, you’re risking a lot in terms of investment, yields, and market image. Challenges exist in nearly every rework scenario, but Walz focused on the four areas he hears customers asking about most often: lead–free site dressing, 01005s, high–mass connectors, and underfilled components. Two elements come into play here for smart lead–free rework: good equipment and a strong understanding of the processes. Issues with extremely–low– (01005s) and extremely–high–mass (connectors) components are resolved through human ingenuity and mechanical precision. Underfilled component rework is emerging, and VJ Electronix undertakes serious collaboration and experimentation to develop solutions.
During the X–ray portion of the open house, Cosentino defined the various — and sometimes confusing — options for 3D inspection. Each has its own rules and specialized techniques, so how you use them is key. Cosentino explained that “virtual” 3D is not a true reconstruction technique. Is full reconstruction best? It depends on your ability to interpret software and data. CT is a true reconstruction, Cosentino notes, but “people can get hung up on all the fancy images.” Highest resolution and smallest focal spot won’t necessarily produce the best results. Voxels, resolution, and energy are part of a balancing act.
Collaboration between suppliers and users is the most direct and effective path to educating operators and programming systems to maximize usage. Knowledge for knowledge’s sake is trivial — knowledge you can apply to improve your business is enticing, and there were plenty of satisfied attendees at Walz’s and Cosentino’s talks. VJ Electronix staff took visitors through some demonstrations on rework and X–ray systems to put these ideas into action. So, can you improve the technology simply by improving the user operating it? Not necessarily, but you can push that technology to it’s maximum usefulness — its “highest tech” — by ensuring that the most advanced and skilled element of the process is the operator directing it.
EU Pushes for Pan–European Research Collaboration
BERLIN — The MINOS–EURONET project entered a new leg of Eastern and Western European collaboration, introducing a roadshow to enhance networking across the EU. The major focus is bringing new member states into EU–sponsored research areas and face–to–face with Western European institutions more familiar with the programs. Organizations from new member states have the opportunity to gain higher visibility within European research in micro/nano technologies, according to MINOS–EURONET. The three–year unification project involves knowledge databases, workshops, brokerage events, and publicity outlets designed to bring Western and Eastern European researchers together. To participate in MINOS–EURONET activities, visit www.minos–euro.net.
April Book–to–Bill
The combined rigid and flex PCB industry book–to–bill for North America improved again in April, reaching 1.01, according to IPC. The book–to–bill numbers are holding steady at a higher level than 2007, confirmed Denny McGuirk, IPC president.
- Shipments for rigid PCBs are up 12.2% and bookings climbed 5.6% from April 2007. Year to date, rigid PCB shipments are up 6.6%; bookings rose by 12.9%. The rigid circuits book–to–bill edged above parity at 1.01.
- Flexible circuits shipments jumped 22.8%, but bookings declined 4.8% compared to April 2007. Year to date, flexible circuit shipments are up 5.0%; bookings are down 14.3%. The flexible circuits book–to–bill remained at 0.99.
- Combined, the flex and rigid PCB market shipments increased 12.9% from the same month last year, and orders booked increased 4.8% over the same period. Year to date, combined industry shipments are up 6.5% and bookings improved by 10.6%. The combined book–to–bill ratio bettered to 1.01.
Euro Shows: NEW and SMT/HYBRID/PACKAGING
NUREMBERG, Germany and LONDON — The summer show season began in June with SMT/HYBRID/PACKAGING in Germany and National Electronics Week (NEW) in London. SMT/HYBRID/PACKAGING boasted an international feel, with foreign companies accounting for 33% of the exhibitors and attendees hailing from 50 countries. This year, the show’s Optics Meets Electronics stand highlighted trends in this emerging collaborative area. Traceability, advanced inspection, and package stacking also were key trends covered in the show’s Forum.
NEW hosted two distinct production lines on the exhibit floor. This exhibit produced two different types of six–layer PCBs, processed against various parameters including surface finish, stencils, solder paste, and reflow processes. The range of process variables was designed to provide each participant with experiments relevant to their own manufacturing experience; NEW promoted the lines as “learning environments.” All boards were X–ray and AOI tested to IPC standards. Visitors heard feedback and analysis from a panel of bare board and solder paste suppliers, and independent experts. The lines were managed by IPC European representative Lars Wallin.
Ahead of Beijing Olympics, China Considered Key Ally
Protests and unrest have followed the Olympic torch relay around the globe, but many see the 2008 Beijing Olympics as an opportunity to increase cooperation with the manufacturing giant. With a huge consumer market and continued dominance in outsourced production, China offers a lucrative partner for developed economies with high labor costs and saturated domestic markets. In return, Chinese investment in U.S. and U.K. is largely coveted. “Prime Minister Gordon Brown and Premier Wen Jiabao have set a challenging bilateral target for increases in trade in goods and services to reach $60 billion by 2010,” asserted the Rt. Hon. John Hutton MP, Secretary of State for Business, Enterprise, and Regulatory Reform, during his address at the Sustainability Business Conference for China and the U.K. Dialogue on financial and economic issues between the two countries has been raised to Chancellor and Vice Premier level, he added.
Hosting the 2008 Olympics in Beijing is a defining moment for China — a clear–cut declaration that the “sleeping dragon” has metamorphosed from rural economy to developing nation to international economic superpower. At least, this is how China’s leaders are determined to see the event unfold. The event cannot take place without massive support from the electronics community; for example, Lenovo will be providing approximately 14,000 pieces of computing equipment for the Games. More than pomp and ceremony, the 2008 Olympics have led the manufacturing world to look in at itself; take stock of the outsourcing era; and stage a dogged battle against the persistent ghosts of lax regulations, weak global responsibility, and closed political fronts. Hutton touched upon the difficulties of China as trade partner vs. China as partner in the international community. “China is, I believe, coming to realize that growing international economic influence carries with it political responsibilities too. And we will continue to encourage China to approach international engagement positively?as responsible members of the international community,” he asserts. Whether they be political or electronics–based, partnerships formed around the Beijing Games will require persistence beyond the August ceremonies to ensure strong business and responsible action remain hand–in–hand.
ADVISORY BOARD UPDATE
SMT Editorial Advisory Board member Gary Tanel joined Associate Equity Group, bringing his 20 years of experience in the EMS business to the established M&A experience of the Associate Equity Group. He will assist in selling and purchasing of EMS businesses, business and technology services, and consulting for various needs. Gary can be contacted at GTanel@AssociateEquity.com.