-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Participate in SMTA Events
June 24, 2008 |Estimated reading time: 1 minute
MINNEAPOLIS The SMTA is requesting papers for presentation at Pan Pac and the Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts. The association's Boston chapter also will be hosting a technical presentation and demo on July 8th.
To participate in the Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts, September 910 in the University of Maryland, College Park, Md., submit an abstract by June 30. This symposium focuses on the solutions available and under development by all sectors of the industry. Topics will include methodologies followed by affected industries to mitigate chances of being victims of counterfeit parts; domestic and international initiatives that will affect the future of combating counterfeit electronic parts; supply chain management to mitigate risks; tools of protection from part manufacturers; inspection; military and avionics threat; sources of counterfeit parts, and authentication techniques for securing electronic part supply chain. The conference is organized by SMTA in conjunction with Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland. To submit an abstract of 300 words or less, e-mail Diganta Das, Ph.D., at diganta@umd.edu.
The Pan Pacific Symposium Technical Committee, including general chair Yutaka Tsukada, Kyocera Wireless; and technical co-chairs Soren Norlyng, MICRONSULT and Juergen Wolf, Fraunhofer Institute, is accepting abstracts for the 14th Annual Pan Pac event. The conference will be held on the Big Island of Hawaii, February 1012, 2009. SMTA is accepting papers on assembly, business issues, interconnection, markets, microsystems technology, packaging, and solar electronics. The event focuses on networking between the U.S. and Pacific Rim countries, as well as international business in general. To qualify to present, submit an abstract by July 31, by visiting www.smta.org/panpac/call_for_papers.cfm.
SMTA's Boston Chapter also announces that its technical presentation, "Advanced Solder Paste Measurement Techniques and Equipment," has been postponed to July 8th at Textron Defense Systems in Wilmington, Mass. To attend or learn more, see details on the event here.