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Product Showcase: SMT/HYBRID/PACKAGING
December 31, 1969 |Estimated reading time: 10 minutes
SMT/HYBRID/PACKAGING will take place June 3 through 5 in Nuremburg, Germany, highlighting new products and processes on the European electronics assembly stage. This year's show features cleaning processes, pick-and-place systems, rework tools, reflow ovens and profilers, solder pastes, machine analysis capabilities, automated tooling for assembly lines, device programming systems, dummy components, XRF analyzers, inspection systems, and more.
Aqueous Technologies Corp. will introduce the Trident, its fourth-generation automatic defluxing system, to the German market. The Trident is capable of removing flux residues including rosin, no-clean, and water-soluble both leaded and lead-free, or mixed. Its automatic post-reflow defluxing process comprises prewash, wash, rinse, cleanliness testing, and drying. Trident's automatic chemical injection system adds a programmable volume of defluxing chemical to the wash water. Prewash offers steam soak, high-pressure DI water spray, or chemical spray and soak. Rinse is controlled by the built-in cleanliness tester. The Trident includes a closed-loop wash solution recycling system. Defluxing and cleanliness testing occurs on up to 200 101- × 152-mm boards and up to 28 457- × 508-mm boards per hour. The user interface delivers instructions in seven languages. Machines can be fixed remotely on a real-time basis. In distributor SYSTRONIC's Booth 431, Hall 7. www.aqueoustech.com.
Assembléon is introducing the MC-12 pick-and-place machine. The MC-12 hosts up to 120 feeders into a 1.25- × 1.44-m footprint. It places at 36,000 CPH. The machine is designed for lowest cost per placement per square meter, and its compact size means that two MC-12 machines can be placed in line. The MC-12 has a 12-mm-thick electrical intelligent feeder platform for flexibility in high-mix production. It comes with two 60-position feeder bars, with a feeder exchange system and a built-in tape cutter as optional extras. The feeder indexing is controlled by advanced servo controls. Self-correcting pick-up (Adaptive Pick) improves pick reliability, even with gang pick. The MC-12 also introduces a recognition system that deploys a moving scan camera with advanced optics. The scan camera simultaneously measures the components in X and Y directions and from the side. It accepts components from 01005 up to 20 × 20 mm, can place chips with 50-µm accuracy at 3 sigma, and offers large-board support to 510 × 460 mm. Other standard features include component side-view camera, a complete set of software options, and a graphical user interface. Assembléon also will display the AX-301 and AX-201 pick-and-place machines at the show. Booth 410, Hall 7. www.assembleon.com.
Balver Zinn and Cobar BV, a member of the Balver Zinn Group, will introduce the XF3 lead-free solder paste. Developed to accommodate reflow profiles without nitrogen, XF3 completes the family of Cobar products based on Nihon Superior's SN100C alloy. SN100C has demonstrated superior long-term fatigue strength over silver-containing SAC-alloys. Completely free of silver, SN100C shines as the only true remedy against Cu-migration into the Sn regions of solder joints. With XF3, wetting on common metal surfaces is excellent, yielding bright shiny joints. It exhibits a robust printing window, printing at 150-200mm per second. SN100C-XF3 performs better in reducing voiding when compared to any SAC-alloy. SN100C-XF3 can be reflowed with an adequate process window. In most cases it can be a drop-in replacement for SAC-based products. Booth 524, Hall 9. www.cobar.com.
BPM Microsystems will display its latest Flashstream automated programming technology, the 3000FS. With four Flashstream programming sites, the 3000FS automated device programmer is designed to solve excessive programming times caused by in-system, JTAG, and in-circuit production programming methods. It is rated at 1,050 devices per hour, handling parts in tray, tube, or tape input/output. The four Flashstream sites use proprietary Vector Engine coprocessor technology to accelerate flash-memory waveforms during the programming cycle. Synchronous operations eliminate dead times. In distributor PB-Technik GmbH's Booth 521, Hall 7. www.bpmmicro.com.
BTU International will feature the Pyramax 75A at the show. With 75" heated length and six zones rather than five, it hits a 350°C maximum temperature while maintaining low power consumption. The system delivers proven quality features like side-to-side recirculation that enhances temperature uniformity, and unmatched convection efficiency that reduces zone temperature set points. Like the other Pyramax ovens, the Pyramax 75A features user-friendly Windows-based WINCON oven control software, parts-identification software, a wide range of options for flux management, advanced conveyor solutions and smart tracking SMEMA, optional barcode reader, and a comprehensive warranty. Booth 207, Hall 7. www.btu.com.
CeTaQ GmbH will launch two advanced services and demonstrate the CmController5 Compact (CmC5 Compact) measurement and analysis tool. The universal CmC5 Compact helps achieve error rate reduction with a complete measurement system and software for vision and statistical analysis. Visitors will also have an opportunity to discuss two new services: "Pick and Place Pressure Measurement Service" and "Wire Bonding Measurement Service." The pick-and-place pressure measurements should help manufacturers regularly monitor that the correct pressure is being applied to sensitive components. The wire bonding assessments measure the machines' capability and optimize the process. CeTaQ also will demonstrate their components and glass plates for measurement and calibration. These are designed to imitate "live" components and real PCBs in failure analysis. Booth 739, Hall 7. www.cetaq.com.
CyberOptics Corporation will showcase its Flex HR enhanced-resolution AOI system with inspection performance for 01005 components and larger. High-speed, Flex HR suits memory, notebook, mobile phone, and automotive assembly production. Base system features include high-speed pre- and post-reflow inspection capabilities with proprietary SAM vision technology. This software also enables inspection on any component or feature such as chips, ICs, empty locations, lead-free solder joints, gold fingers, connectors, clips, and screws. System enhancements include barcode reading with system cameras, dual-stage defect review and repair, and lot management improvements. CyberOptics will exhibit its easy-to-use operator user interface (OUI) for the Flex HR along with the system. The company also will highlight its SE 300 Ultra 3D solder paste inspection system. In distributor GPS Technologies GmbH's Booth 430, Hall 7. www.cyberoptics.com.
Europlacer will display its iineo SMT platform with a single-head/eight-nozzle configuration. The iineo platform features many improvements to the Europlacer machine range such as a higher feeder count, increased board size, and increased maximum component height. The platform uses the company's core features: turret head, intelligent feeders, and proprietary software. It also has linear motors and digital cameras. Possible configurations include single or dual linear motor gantry including a rotary turret head with 8 or 12 pickups, one or two board positioning mechanisms, oversized board options, and feeders in front and rear or front only. The single-head iineo can handle maximum PCB sizes of 700 × 460 mm with options to handle up to 1610 × 600 mm. Board location on both single- and double-head systems is full edge clamping with fiducial correction, and both systems feature a SMEMA interface. The single-head iineo features one nozzle with 40 positions in its "smart" nozzle tool bank. Both systems feature standard placement accuracy of 35 (QFPs) to 60 µm (chips), full range of intelligent feeders for 8-88 mm tapes for components in plastic sticks and matrix trays, and a feeder capacity of 264 × 8 mm. The single iineo has a rotary turret pick-up head on X/Y linear motor gantries with eight pickups each. Options include glue dispense with Archimedean screw, electrical test, fixed camera, conveyor auto-width adjustment, special nozzle magazine, and more. This platform is accompanied by additional software products, including multi-job optimization and wireless stock management linked to the customer's ERP. Booth 206, Hall 7. www.europlacer.com.
KIC will launch KIC Vision with additional automatic capabilities. The KIC Vision automatically measures a product's thermal profile as frequently as once an hour. While it runs in the background to measure the product profile at a set time interval, it now can also shut down the feed conveyor when the measured profile is no longer in spec. This alarm function saves costly rework and scrap, and improves product quality. The new optional SPC package automatically logs basic SPC charts, including Cpk, every time a new profile is measured. The KIC Vision option will warn when the next profile's Cpk level has dropped below the user selected level. The data collected by the system now can be output automatically to an external file for further data management by the user. The enhanced KIC Vision capabilities are designed for a higher level of automation for the electronics manufacturers' thermal process. These tools reportedly increase quality and productivity while offering an improved level of process documentation and traceability. KIC also will be showcasing its Explorer thermal profiler. In distributor Multi-Components' Booth 320, Hall 7. www.kicthermal.com.
Kyzen Corporation will introduce AQUANOX A4241 PCB and stencil cleaner. AQUANOX A4241 aqueous cleaning solution was designed with an inhibition technology to be effective on the toughest soils while protecting the most sensitive parts from etch or darkening. It suits spray batch, spray in-line, and stencil cleaning processes. A4241 will provide shiny solder joints with no sump-side additives and consistent cleaning results with minimal bath monitoring. AQUANOX A4241 is multi-metal safe, including bare aluminum and copper. A non-flammable, non-corrosive liquid, it is compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes. AQUANOX A4241 is a non-hazardous, biodegradable aqueous solution that contains no CFCs or HAPs. The company also will highlight its AQUANOX A4651US low-pH ultrasonic immersion cleaner. Booth 340, Hall 7. www.kyzen.com.
OK International will showcase a range of new product innovations, including the PS-900 soldering technology, MFR-2200 Series soldering and rework system, and PCT-1000 programmable pre-heater. The PS-900 soldering system is engineered to deliver high power with superior thermal control at a low cost of ownership. Powered by OK's SmartHeat Technology, the PS-900 reportedly can provide an exceptionally fast response when under load, while eliminating the potential for thermal overshoot. OK International also will demonstrate the MFR-2200 Series high-power solution for production hand soldering, touch-up, and SMD rework. Users can operate one or two different handpieces at the same time for optimal flexibility. The PCT-1000 programmable pre-heater is engineered to simultaneously lower soldering and rework temperatures and improve process efficiency. Users can deliver more heat to difficult boards while maintaining high levels of thermal control. OK International also will be using the SMT show to display its range of production assembly equipment, including soldering and rework systems, advanced package rework, benchtop fume extraction and fluid dispensing systems. Booth 228, Hall 9. www.okinternational.com.
Ovation Products will showcase the Grid-Lok HD high-density automated tooling system. Designed to support the entire PCB assembly, its 12-mm pin pitch can be set up quickly for complete and flexible board support. The tooling system suits high-changeover manufacturing environments. It conforms to any given board profile and individual substrate topographies, with pins automatically locked into position. The company also plans to highlight its Magna-Print universal SMT squeegee system. In distributor BEN TECHNOLOGIES' Booth 413B, Hall 8. www.ovation-products.com.
Practical Components will showcase the Amkor Technology dummy components available. Among the products are the traditional "off-the-shelf" leadframe configurations, leading-edge chipscale, flip chip, and system-in-package (SiP) solutions. Also available are Amkor middle stacked package components that makes a triple-stack PoP package (PSvfBGA). These are 12 × 12 mm, 0.65-mm-pitch stacked daisy chain components. In distributor AAT Aston GmbH's Booth 243, Hall 7. www.practicalcomponents.com.
RMD Instruments LLC will premier a new solder analysis and identification features of its LeadTracer-RoHS XRF system. The system is designed for the electronics industry dealing with RoHS directives. RMD added a solder analysis and identification feature that identifies solder alloys within minutes. The solder analysis and identification feature addresses various potential "weak links" in the production chain, especially in a dual-alloy manufacturing operation. The LeadTracer-RoHS XRF system analyses the entire body of the components. The LeadTracer-RoHS' ability to analyze the entire energy spectrum eliminates the possibility of false-negative indications. The LeadTracer-RoHS XRF system is available with a sample preparation stand with "quick disconnect" grip. In distributor SmarTec's Booth 219, Hall 7. www.rmd-leadtracer.com.
Zestron America will showcase its process development, optimization and cost reduction program. Members of ZESTRON's chemical engineering team will be on hand to provide solutions for cleaning needs before, during, and after process implementation. Customers can arrange free-of-charge cleaning trials in ZESTRON's Technical Center, which features a selection of machines from the industry. Using production-floor cleaning conditions, ZESTRON reportedly guarantees an appropriate cleaning process solution. ZESTRON's application technology and sales team will be readily available to answer questions. Booth 225, Hall 7. www.zestron.com.