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Wave Height Monitor
December 31, 1969 |Estimated reading time: 11 minutes
Wave Height Monitor
The monitor and control feature for KISS selective soldering equipment can maintain solder wave heights to within ±0.005", targeting soldering operations with small, tight-pitch components in high-volume automated production environments. It suits the smallest wave nozzle sizes, under 6 mm and down to 1.5 mm. Combined with nitrogen-inerted solder delivery and a nitrogen air-knife, the tool helps with demanding selective soldering operations in high-volume/high-reliability assembly. The monitoring module’s methodology incorporates resistive measurements of wave height relative to a known reference. This is performed at programmable intervals during extended production runs, and closed-loop feedback helps automatically adjust solder pump speeds, and therefore wave heights. ACE Production Technologies, Spokane Valley, Wash., www.ace-protech.com.
LXI Literature
The second edition of LXImate is 130 pages with an easy-to-read description of the LXI standard, product availability, and its evolution. The book provides sections on the discovery process, Webpage usage, software principals, and trigger systems. In addition, sections describe the general principles of the wired trigger bus that provides a low latency trigger exchange system and the IEEE1588 protocol that can gives an LXI test system knowledge of time and can be used to generate time-based triggers. A description of the compliance process used by the LXI Consortium and examples of compliant products are included. LXImate has been reviewed by senior members of the LXI Consortium and is designed to take the mystery out of adopting a new standard into test platforms. When more detail is needed, the complete specifications are on the LXI Consortium’s Website. Pickering Interfaces, Clacton on Sea, U.K., www.pickeringtest.com/lximate.
Precision Coating/Dispensing System
Precisioncoat RTV is designed to apply room-temperature vulcanization (RTV) materials. RTV silicone adhesives and sealants offer reliable protection and flexibility to components that may be exposed to vibration, temperature extremes, moisture, salts, electricity, and other elements. As form-in-place gaskets, RTV materials seal and protect housings. The RTV materials automatically dispensed by the in-line system suit circuit boards in automotive, aircraft, machinery, and other areas with delicate components under vibration stress. RTVs can seal connectors with a moisture barrier as well. The Precisioncoat RTV is controlled by proprietary software on a Windows XP operating system and is fully programmable. Accurate application and bead control target reduced material use. The standard configuration applies coatings on a three-axis system; fourth and fifth axes can be added for tilt angles up to 45° or 360° rotation functionality. Specialty Coating Systems Inc. (SCS), Indianapolis, Ind., www.scsequip.com.
Boundary Scan Module
The SFX-6308 module joins the JTAG/boundary scan hardware platform SCANFLEX. This I/O module features eight independent analog I/O channels with additional digital resources, and supports application-specific in-system reconfiguration with integrated VarioCORE technology. It reportedly allows tighter interactions between analog tests and boundary scan operations. SFX-6308 provides four output channels with extended current yield of up to 200 mA at ±10 V and four bipolar input channels with a range of ±10 V. All channels have a 12-bit resolution and can be disconnected from the UUT via relays. The module can be combined with any SCANFLEX controller. Standard features include programmable range selection and external triggering. It tests analog/digital converters, DC/DC transformers, digital/analog converters, digital potentiometers, and low-resistance input stages in interaction with boundary scan operations. Reconfiguration of the integrated module resources allows programming of complex dynamic I/O functions that can be run autonomously. GOEPEL electronic, Jena, Germany, www.goepel.com.
Enhanced Placement Series
SMT placement machines FLX2011, FLX2021, and FLX2031 have become faster and more precise, with a larger feeder capacity and small machine footprint, according to the company. Component sizes from 01005 to 50 × 50 mm can be handled and placed, and solder paste and adhesive can be dispensed using the same machine. The FLX-MIS software automates planning and optimizes setup for maximum throughput/minimum modifications. New setup procedures can be entered while the current production batch is processed. The FLX2011 features a 92 × 92 cm footprint with access to 190 different components. The large-version FLX2010-L can store up to 310 component types. Enhanced machines feature placement throughput increase by 20% to 6000 CPH, achieved with a higher drive power and intelligent optimization of head movements. The measuring system also features upgraded resolution, by a factor of five. Essemtec, Aesch, Switzerland, www.essemtec.com.
Power MOSFET Component
The first device in a third-generation TrenchFET power MOSFET family, Gen III Si7192DP is an n-channel device in the PowerPAK SO-8 package, featuring maximum on-resistance of 2.25 mΩ at a 4.5-V gate drive voltage. On-resistance times gate charge is 98. Lower on-resistance and lower gate charge are said to translate into lower conduction and switching losses, respectively. Siliconix Si7192DP will be used as the low-side MOSFET in synchronous buck converters and in secondary synchronous rectification and OR-ing applications. Its low conduction and switching losses target more power and space-efficient designs for voltage regulator modules (VRMs), servers, and a range of systems using point-of-load (POL) power conversion. Vishay Intertechnology Inc., Malvern, Pa., www.vishay.com.
Bonder Retrofit for Heat Staking
Heat staking can be performed with a reportedly quick and inexpensive tooling and thermode retrofit on desktop bonders. These bonders traditionally are used for hot bar reflow soldering and bonding processes. The company claims retrofitted desktop bonders perform heat staking for high-tech and consumer applications at lower cost that designated equipment. It offers applications and process development support with the product. Miyachi Unitek, Monrovia, Calif., www.muc.miyachi.com.
Programmable Preheater
Suiting high thermal demand applications such as lead-free, multi-layer boards, and large ground planes, the PCT-1000 is designed to improve process efficiency and control. PCT-1000 maintains thermal control and lower operating temperatures in soldering, desoldering, and SMD rework operations. The benchtop system delivers forced convection heat that can be controlled with four time and temperature zones and an additional cooling zone. The PCT-1000 also provides a thermal boost for added heat capacity. The preheater features an external thermocouple input, wherein a Type K thermocouple can be attached to a component, or PCB site, to provide target temperature feedback control to the PCT-1000 and therefore prevent exceeding the maximum temperature at the board. The thermocouple input feature can also be used as a process monitor. The heater design creates a convection vortex, concentrating heat where it is most needed. Up to 50 thermal profiles can be stored in the PCT-1000. OK International, Hampshire, U.K., www.okinternational.com.
Attenuators to 3GHz
Designed to be cost effective, the 0404-size thick film on alumina attenuator IMS2479 is available in -1 to -10 dB attenuation values in 1-dB increments with attenuation accuracy starting at ±0.3 dB. Operating frequency for the IMS2479 is DC to 3 GHz with a rated power of 40 mW. The attenuators suit RF and microwave applications, as well as a range of other products. International Manufacturing Services Inc. (IMS), Portsmouth, R.I., www.ims-resistors.com.
Soldermasking Oven
No. 930 is an electrically heated, 500°F inert atmosphere cabinet oven for liquid flow soldermasking under a nitrogen atmosphere. A 1500-CFM, 1.5-HP recirculating blower provides horizontal airflow to the load. The oven features 4" insulated walls, aluminized steel exterior, Type 430 stainless steel interior, and an automatic door switch to shut off heaters and blower when the door is opened. Inert atmosphere construction features include a pressure regulator, flow meter, pressure gauge, inner oven walls sealing directly against a silicone rubber door seal, air jacket on the inner oven for cooling, blower shaft seal, interior seams welded gas-tight, and compression fittings on all oven wall penetrations. No. 930 also includes a digital programming temperature controller. THE GRIEVE CORPORATION, Round Lake, Ill., www.grievecorp.com.
Mobile Measurement Method
The mobile measurement tool suits statistical process control (SPC) requirements, reportedly imitating regular production processes as closely as possible to maintain accuracy and repeatability of production equipment. Users can tailor the measurement layout, including number and type of components, board size, specific head, nozzle, placement angle configurations, and other elements specific to machine requirements. This replicates conditions in which the machine works in daily production, which is said to help find the root causes of weak points better than other techniques. CeTaQ, Hudson, N.H., www.cetaq.com.
NAND Programming Upgrade
FlashCORE Boost technology creates performance gains for NAND flash memory devices, operating as an extension of FlashCORE II. Hardware and software upgrades to Boost are available. The technology increases NAND programming and verification speeds by up to 400%, according to the company. It is said to increase production throughput, even with high-density memory devices. Data I/O Corporation, Redmond, Wash., www.dataio.com.
Solder Paste Printer
The SI-P850 solder paste printing system enables 0.3-mm fine-pitch designs. It handles a range of PCBs, suiting mobile device boards through informative system assemblies. Precision reaches ±20 μm. The machine includes automatic cleaning functions and a dedicated rigid frame and reportedly high-accuracy AC servo motors. Cleaning options are available for roll-paper or cloth; wet, dry, suction, and varied repetitions. The SI-P850 offers Chinese, English, and Japanese operating languages. Sony Manufacturing Systems Corporation, Lake Forest, Calif., www.sonysms.com.
Gaskets Catalog
At 80 pages, the Extruded EMI Gaskets catalog offers physical, electrical, thermal, and regulatory information on conductive elastomeric extruded gaskets. The products are available in standard and custom profiles for computing, telecommunications, gaming, medical, automotive, and industrial assemblies. An EMI gasket design section helps electronics designers specify proper gaskets to suit a given application. Chomerics, Parker Hannifin Corporation, Woburn, Mass., www.parker.com/chomerics.
Soldering and Rework System
Featuring SmartHeat technology, MFR-2200 series systems suit production hand soldering, touch-up, and SMD rework. Users can operate one or two different handpieces at the same time, enabled by a control switch. Supporting the MFR-2200 simultaneous dual-port operation are three handpieces and a range of soldering and rework cartridges, similar to the company’s Metcal range, and tips. These include a cartridge handpiece with a variety of fine access and SMD rework tips, a high-power soldering tip handpiece designed for volume production environments, and a Precision Tweezer handpiece capable of removing 0201 chips to 28-mm SOICs. OK International, Garden Grove, Calif., www.okinternational.com.
Placement System Software Upgrade
The EASYPLACER 7.2 software package enhances the application range of the FLX pick-and-place series. It targets increased line productivity and expanded component range. EASYPLACER version 7.2.0.0, BOX version 7.5.0.0, LIB version 7.2.0.0, and optional CAD version 7.2.0.0 comprise the upgrade. EASYPLACER 7.2.0.0 includes job function, lifetime counter, production time counter, selectable speed or accuracy optimization, 01005 placement with special nozzle, warning messages, and more precise placement of MFOV components. In BOX 7.5.0.0, the current feeder allocation of all feeders can be saved as a job and reloaded if necessary, allowing users to always use the same feeder allocation for a particular production. This package also includes a new dialog to define or edit feeders: only components with the appropriate tape width can be added to a feeder position; only components applicable to the selected feeder position are shown; feeder allocation saves automatically, etc. Lists of the definitions, including the current feeder allocation, are printable. BOX 7.5.0.0 also includes a FLX-BAR-2 option for barcode-assist in feeder setup. LIB 7.2.0.0 includes corner marking of palettes, selectable speed or accuracy optimization for each component, free definable rotation speed of A-axis for each component, vacuum activation at pick position, and definable vision window angle for each component. Essemtec AG, Aesch, Switzerland, www.essemtec.com.
AOI Training Tool
iMentor is a training and support system designed to help new and experienced operators get the most out of the company’s range of advanced AOI technologies. Targeting shortened programming times and improved inspection results, iMentor also can improve operator productivity and process optimization. A Web-based tool, it also can be used offline. iMentor incorporates step-by-step guidance supported by screen shots, with a search feature into the online manual and the company’s Frequently Asked Questions database. Its front page alerts users about new software releases and MainStampLibrary updates. The tool minimizes text in favor of clear illustrations. Marantz Business Electronics, Eindhoven, the Netherlands, www.escapethegreyworld.com.
Updated Enterprise-level Software
vPlan v1.2 enterprise-level process engineering software solution for electronics assembly introduces features to enhance production transfers between lines and factories even when CAD and AVL data is not available. It also helps create efficient manufacturing process definitions (MPDs). The updated version adds coverage for additional machine models and allows users to import and optimize existing machine programs even when no CAD or BOM data is available. Grouping can be applied, and the resulting model can be restored back to the original line or transferred to any other line. Version 1.2 allows extraction of footprint data and component lists from Gerber and enhanced CPL-to-Gerber data alignment. Users import legacy parts data and convert them into vShapes. It also generates output for feeder setup based on alternative parts. Administrators create standard workflows for all users. The company added 10,000 vShapes, and full JEDEC trays have been added to the supply form library. Enhanced filtering capabilities are built-in. Valor Computerized Systems Ltd., Yavne, Israel, www.valor.com.
Production Management Software
Proficy Plant Applications Version 4.4 includes new features for production management and product traceability, and also supports VMware virtualization, Citrix remote desktop architectures, and Microsoft Server Clustering. Version 4.4 offers new Model Configuration tools to expand the suite’s event detection and modeling subsystem. Improved deployment tools also help make production system configuration faster and more repeatable, according to the company. Upgraded runtime displays and enhanced reporting capabilities improve the software’s ability to transfer accurate information to the correct contact at the facility. By connecting Proficy Enterprise Connector, or Proficy Maintenance Gateway products into the events and information within Plant Applications, users can make integrate plant and enterprise systems. The advanced architecture of Plant Applications 4.4 is non-intrusive to plant-floor controls and operations and supports the broad range of production environments present in typical global companies. Its applications are modular and scalable to support installations of varying scope and size. GE Fanuc Intelligent Platforms, a unit of GE Enterprise Solutions, Charlottesville, Va., www.gefanuc.com.
Flexible Substrate Plating System
The Excellite FSP for flexible substrate plating suits high-density interconnect (HDI) production processes, blind-via fill, thru-hole plating, and other electronics/metal-finishing jobs. It is a roll-to-roll/continuous strip electroplating and wet processing system designed principally for flex circuits, RFID, and solar cells. It reportedly handles delicate materials without damage. Precision Process Equipment, Niagara Falls, N.Y., www.precisionprocess.com.