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From the Show: IPC News Wraps Up APEX
April 4, 2008 |Estimated reading time: 3 minutes
LAS VEGAS IPC Printed Circuits Expo/APEX/Designers Summit, this week in Las Vegas, provided an international platform for diverse launches in technology, collaborations, and products. IPC also unveiled several initiatives and awards at the show, including a joint symposium with the SMTA, volunteer and corporate honors, and best papers. APEX 2008 has come to a successful close, and IPC will return the show to Las Vegas in 2009.
The SMTA and IPC will co-present the High-performance Electronics Assembly Cleaning Symposium October 2829, 2008, in Rosemont, Ill. The symposium will focus on all classes of high reliability and high performance electronics assembly and will include case studies from manufacturing experts in the aerospace and defense, automotive, consumer telecommunications, and medical products industries. Abstract submissions, about 300 words, are sought on future cleaning challenges, cleanliness assessment, no-clean, spot cleaning, conformal coating, materials compatibility, environmental issues, standards, and related areas. Abstracts must summarize technical and previously unpublished, non-commercial work covering case histories, research, and discoveries, and are due by May 5, 2008. Preference will be given to submissions for papers in high-reliability and high-volume production segments. Submit at www.ipc.org or www.smta.org.
At APEX, IPC's technical program committee selected best U.S. and international papers via ballot vote. More than 100 papers were submitted for consideration. "Design for Manufacturability in Lead-free Wave Solder Process," Ramon Mendez, process development engineer, Celestica, took International Best Paper. Co-authors included Mario Moreno, German Soto, Jessica Herrera, and Craig Hamilton, all from Celestica. Honorable mention for international papers went to Bev Christian, director of the Materials Interconnect Research Group at Research In Motion (RIM Ontario) for "Ionic Analysis of Common Beverages Spilled on Electronics." Assisting Christian were co-authors Alexandre Romanov of RIM, and Cameron O'Neil, a student at Dalhousie University.
Brandon Gore, signal integrity engineer, Intel Corporation's Packaging and Interconnects Group, won the U.S Best Paper award for "Toward a PCB Production Floor Metric for Go/No-Go Testing of Lossy High Speed Transmission Lines." Martyn Gaudion, Polar Instruments, shared in the honor as a co-author. A U.S. honorable mention recognized Ning-Cheng Lee, Ph.D., VP of technology at Indium Corporation of America for "A Compliant and Creep Resistant SAC-Al (Ni) Alloy." Benlih Huang, Ph.D., and Hong-Sik Hwang, Ph.D., Indium, co-authored the paper. In addition, Aaron Unterborn, senior engineering manager at Flextronics International, along with co-authors Ken Wilson and Charles Merz, Flextronics International, shared the honor with "Methods for Choosing a Saponifier or Surfactant for PCB and Stencil Cleaning Applications." Copies of the winning papers are included in the 2008 Technical Conference Proceedings.
IPC honored its members that facilitate the APEX event, along with the association's development and standards initiatives, at the show. IPC presented 10 Special Recognition, eight Distinguished Committee Leadership and 32 Distinguished Committee Service awards to individuals who made significant contributions to IPC and industry by lending their time and expertise to committees and standards and programs development. Special Recognition Award recipients are Mark Jankowski, Constantin Choueiri, Ruth Delker, Javier Jimenez, Scott McCurdy, Debbie Nygaard, and Glenn Wells, along with Scott Strand, Gerald Leslie Bogert, and Nancy Chism.
Distinguished Committee Leadership Awards went to David Bieber, Mark Jankowski, Kelvin Low, Edward Kelley, Henry Sanftleben, David Vaughan, and Peggi Blakley. Distinguished Committee Service Awards were presented to John Jephson, Doug Sober, Thomas Farrell, Michael Green, Douglas Pauls, and Gordon Sullivan, along with Hayao Nakahara, Karen Carpenter, Michael Freda, Yoshiyuki Tanaka, William Butman, Terry Clitheroe, Jennifer Day, Stephen Fribbins, Constantino Gonzalez, Greg Hurst, Bernard Icore, Leo Lambert, Brian Langley, Ximena McKenna, Randy McNutt, James Moffitt, Barry Morris, Norma Moss, Gregg Owens, Doug Rogers, Teresa Rowe, Joseph Sherfick, Blen Talbot, Zenaida Valianu, Sharon Ventress, and Debbie Wade. For more information on these awards and the award recipients, contact Anna Garrido, IPC director of marketing and communications, at (847) 597-2804 or annagarrido@ipc.org.
Corporate partners also received special recognition. Colonial Circuits, Inc. and Lockheed Martin received the Peter Sarmanian and Stan Plzak Corporate Recognition Awards, respectively. These awards are bestowed in recognition of their steadfast support of IPC and inveterate contributions of their time and expertise to standards development and other vital IPC activities. Colonial Circuits has been an IPC member since 1981 and is a current member of IPC's Executive Market and Technology Forum. Nearing a century of service, Lockheed Martin is just one year away from celebrating its 50th anniversary as an IPC member company. More than three dozen Lockheed Martin staff provide their leadership and technical expertise on 110 standards development committees ranging from assembly and design to boards and supply chain standards.
APEX will be back next year, taking place at the Mandalay Bay Resort & Convention Center in Las Vegas, March 29 to April 2, 2009. For details on any IPC APEX announcements, see www.goipcshows.org.