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IPC APEX Product Preview
December 31, 1969 |Estimated reading time: 7 minutes
The IPC Printed Circuits Expo/APEX/Designers Summit will take place April 13 in Las Vegas. Following are more product previews for the event, including dispense system, squeegee tooling, fluxers, test systems, rework tools, machine updates, microscopes, cleaners, and other materials, equipment, and software for the electronics assembly market.
Printing PlatformA large-area version of the Europa print platform, Europa Vi offers substrate printing to 24 × 24" for diverse volume, mix, and size requirements. Designed for integrated manufacturing and process optimization, Europa Vi delivers extended flexible substrate image size range from 1.50 × 2.00" to 24 × 24". The system handles boards up to 16.5 lb and 0.236" thick. Europa Vi accommodates the company's Instinctiv productivity tools. Product size conversion to large boards is enabled by fully adjustable transport rails and a two-speed board transport control system with software time lag control. The platform is pre-configured with an understencil cleaner deploying a four-stage head using wet, vacuum, and dry strokes. A vacuum filtration unit is included. Consumables include longer board clamps in standard over-the-top clamps, foiless clamps, or edge clamps (snuggers). Side bars can be used to adapt the large print area down to the standard 29 × 29". Europa Vi delivers stability, accuracy, repeatability, and flexibility to maximize output with a diverse range of substrate sizes, according to the company, noting advanced technology backplanes, solar and fuel cell panels, and multi-up substrate printing applications. DEK, www.dek.com. Booth 1659.
Universal Squeegee SystemThe Magna-Print universal SMT squeegee system comprises a universal-fit squeegee holder, infinitely adjustable paste deflector,s and corresponding blades to accommodate any PCB size. The quick-change blade holder is equipped with an arrangement of magnets and other features that hold the blades, eliminating tooling and loose hardware for blade change. No crevasses, as with traditional holders, allow solder paste to accumulate and harden, enabling easier cleaning. The system also boasts a no-stick coating. Currently the holder fits most DEK, MPM, and EKRA printers, and includes adapters for 45° and 60° mounting. Ovation Products, www.grid-lok.com. Booth 2471.
Jet DispenseThe PicoDot jet dispensing systems combine high production speed with reported accuracy and process control. Piezoelectric technology lets the non-contact system jet fluid onto the substrate, without precise height positioning or Z-axis movement. They suit a range of low- to high-viscosity assembly fluids on products with uneven substrates or in hard-to-access areas, at speeds up to 150 dots per second, with shot size starting at 0.002 µl (2 nl). EFD Inc., www.efd-inc.com. Booth 1470.
Spray FluxerEZ-Flux ultrasonic reciprocating spray fluxing system represents an economical ultrasonic spray fluxing system designed on a reciprocating platform. The ultrasonic atomization module in EZ-Flux uses a high-impact flux transfer system for maximizing topside fill. The system can be integrated into wave solder machines and is compatible with all PCB fluxes, including fluxes that contain rosin. The machine targets small- to mid-size PCB manufacturers in high-quality markets. Sono-Tek Corporation, www.sprayfluxing.com. Booth 263.
Flying Probe TesterAERIAL M4 is a flying probe system with a vertical and compact architecture. The system minimizes floor space requirements and offers reportedly fast and stable double-side probing. Oscillation caused by a horizontally mounted unit under test (UUT) is eliminated by the vertical setup. The Aerial series is based on proprietary VIVA integrated platform (VIP) technology, which is designed to provide a range of test techniques and automatic programming tools without requiring highly specialized personnel. Seica, www.seicatestsolutions.com. Booth 205.
Solder Paste AnalyzerShareGen SPA 1000 Solderpaste Analyzer is said to provide fast and accurate testing to help control solder paste in the production process. It helps reduce a range of defects including missing components, tombstoning, component misalignment, and non-wetting to reduce inspection and rework. The SPA 1000 is a 6-in-1 solder paste test system that can perform up to six separate tests, in accordance to IEC 61189-5 and IPC-TM-650 standards. The system can also be used to conduct solder paste open-time testing. Ascentech, LLC, North American distributor for GEN3 Systems Ltd., www.ascentechllc.com. Booth 241.
BGA Rework ToolThe ONYX 29ATC provides automation and process control for BGA rework. The Tool Changer automatically selects and changes nozzles based on program instructions. A Pick & Prep station provides automatic component pickup and preparation, including flux dipping, paste-on-device, and solder paste dipping. The Process Development Wizard automatically creates a complete rework process based on users' responses to five structured prompts. Other key functions include automated non-contact site cleaning, force-controlled auto placement, and motorized vision/zoom. Air-Vac Engineering, www.air-vac-eng.com. Booth 2311.
Vision System The vision centering system offered on the L-Series pick-and-place system uses the full features of Cognex Machine Vision. Bottom, top, on-the-fly, or fly-by centering options are available, depending on application, process, and budget. The system enables precise placement of 0201s, micro-BGAs, and ultra-fine-pitch QFPs. Cognex Machine Vision capabilities, along with 2-µm resolution scales, are designed for accurate placement on the systems. APS NOVASTAR, www.apsgold.com. Booth 257.
Assembly ToolsFeatured products include the SCBL-77 15 slot vertical buffer system with multi-language support and advanced features; the BC-60 and BC-100 PCB handling systems; the PRO 6Td vision-guided, dual-head robotic soldering system, which can be configured with iron tips, diode lasers, or soft beams; and the PRO 2418 benchtop CO2 laser marking system. PROMATION, www.pro-mation-inc.com. Booth 1875.
Integrated Microscope Inspection SystemsThe Omano OMPCB-23/99 electronic inspection microscope is a complete inspection system that enables continuous inspection in three dimensions, across the length and breadth of a PCB, without the need to constantly check positioning. The optical core features a choice of the OM2300 745× or OM99 6.545× zoom stereo microscope body. An oblique viewing attachment with integrated 0.3× Barlow lens enables the operator, with fingertip adjustments, to view the PCB vertically as well as from all sides. The system also features a built-in, rotatable, light mount that will fit most brands of fiber-optic illuminators and a large sliding stage. The OMPCB-23/99 is anchored by a solid metal alloy stand. The Omano OM2300/V3 combines OM2300 745× zoom stereo microscope body with a new V3 base. The base, which is made of solid metal alloys, is designed to offer an economic, ergonomic solution for repetitive inspection and soldering procedures. It measures 12 × 12" with beveled edges for operator comfort and a black/white contrast plate. Omano is an own-brand, range of microscopes owned by The Microscope Store, LLC, www.microscope.com. Booth 840.
X-ray Inspection UpgradeQuad View facility and dual LCD monitors were added to the Revolution system to enhance its viewing capabilities and user-friendly operation. The Quad View facility allows four images to be displayed at once for detailed inspection or image comparisons. This facility is supported by dual LCD monitors that provide a means to separate X-ray images from the software control for clutter-free viewing. By allowing samples to be safely placed within 250 µm of the focal spot, the Revolution can provide up to 13000× system magnification at all angles over the entire 400- × 400-mm manipulator scan area. Proprietary Xi "Open Tube" X-ray source is small and allows X-ray images of fine detail in thick and dense samples to be examined. A NanoTech target is capable of feature recognition to approximately 500 nM. An advanced electromagnetic lens keeps images in focus at all kV settings. X-Tek, www.xtekxray.com. Booth 881.
Stencil CleanerStencilWasher-CLR provides fast and efficient solder paste and adhesive removal, according to the company. The semi-automatic system is designed to remove all solder paste types including no-clean, rosin, and water-soluble. It also targets uncured SMT adhesives. A filtered and recirculated wash system and a closed-loop rinse system keep all rinse water captured, filtered, re-deionized and reused. There is no connection to drain. StencilWasher-CLR comes standard with wash, rinse, dry, filtration, and closed-loop functions. It is equipped with a wash-solution heating system and a wash solution recirculation and filtration system. A digital wash cycle timer automatically controls immersion transducers, providing precise control over the wash time. Handheld rinse wand and airknife provide fast and thorough rinsing and drying functions. Aqueous Technologies Corp., www.aqueoustech.com Booth 2431.
Advanced Adhesives Conductive and non-conductive adhesives for die attach and flip chip applications, heat conductive adhesives for thermal management, and dippable solder pastes for BGA packaging will debut at APEX. The ball dippable paste series (BD) is designed to enable manufacturers to use SOP substrates while maintaining yields. The BD paste allows the balls to be dipped in solder before placement, preventing ball movement and eliminating printing processes. Other, future applications for dippable pastes include package-on-package (PoP) applications and copper stud bumping. Other conductive and non-conductive adhesives for die attach applications, such as LED attachments, hybrid circuits for the automotive and semiconductor industries, the imbedded electronics in smart card and flip-chip applications will be available, along with standard- and fast-curing adhesives for thermal management applications. The Contact Materials Division (CMD) of Heraeus, www.wc-heraeus.com. Booth 457.
SPI SystemSE 300 Ultra 100% 3-D solder paste inspection system provides accurate, repeatable results at in-line speeds, according to the company. The SE 300 Ultra incorporates the technology and features of the SE 300 along with programming time and inspection setup improvements, SPC charts, an optional system sensor with an extended height range that can measure paste height up to 24 mils, and a mechanical board stop solution. Other recent additions include 1D and 2D multiple barcode reading using the system sensor, an off-line defect review workstation, 01005 pad inspection capabilities, enhanced warp compensation for flexible circuits, and conveyor auto-width adjustment capability. Paste height accuracy is verified by 200 thousand reference points. The Ultra also features paste height, area, and volume measurements with Gage R&R <10 percent. CyberOptics Corporation, www.cyberoptics.com. Booth 2215.
To view more APEX highlights, see our March issue or read last week's Product Preview.