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APEX Product Preview
December 31, 1969 |Estimated reading time: 10 minutes
Following are product highlights for IPC Printed Circuits Expo/APEX/Designers Summit, coming up April 13 in Las Vegas. SMT will provide continuous APEX coverage for readers in SMT WEEK e-newsletters and print issues leading up to, during, and following the show. These products include new packages, reflow oven controls, paste and glue dispensers, solder dross recovery systems, pick-and-place machines, RoHS screening services, and more.
Selective Soldering SystemThe 350 selective soldering system is a low-cost machine designed with numerous standard features and lead-free capability. Its servo drive includes X/Y/Z/A axes. The soldering unit boasts forced-hot-air nitrogen preheat at the miniwave nozzle, limiting dross buildup and extending the process window. A nitrogen management system reduces nitrogen consumption. Standard features include spray or micro-dot drop fluxer, 5-liter pressurized flux tank, quick-exchange 4- to 30-mm-diameter miniwave nozzles, exchangeable lead-free-ready 110-lb-capacity solder pot, auto-feeder solder roll, wave-height control, float sensor, and on- or off-line programming software. Options include dual-nozzle, dual-fluxing capability, allowing flexible operation with multiple nozzles on one PCB; and an endoscopic process camera for real-time monitoring. Juki Corporation, Soldercom, and Intertec, www.jas-smt.com. Booth 2025.
Jetting AlternativeCamalot's SmartStream non-contact dispense pump technology offers a cost-effective, accurate, and easily maintained alternative to jetting. This new, innovative system features Streaming, a patent-pending technology whereby material is dispensed in a narrow column, rather than a single sphere. Well-suited to underfill applications, SmartStream eliminates needle use and incorporates positive displacement of the dispensed material with a piston and barrel combination. Piston control via closed-loop servo drive achieves high accuracy and repeatability for consistent results. Durability, ease of maintenance, and low cost of ownership were design drivers. Unlike other methods, SmartStream does not strike the nozzle/seat with the piston, so internal wear is greatly reduced and operation is quieter. An industrial sapphire insert resists nozzle abrasion from dispensed materials. The fluidic module is separate from the pump and easily removed without special tools. Routine maintenance is minimal and low-cost. SmartStream is field-retrofittable and compatible with current options. Speedline Technologies, www.speedlinetech.com. Booth 2445.
Wave Solder FluxThe next-generation, VOC-free, no-clean, water-based, non-flammable wave solder flux ALPHA EF-2210 provides high throughput and yield for electronic assemblers; high electrical reliability (passes Bellcore SIR); excellent solder performance, including hole fill with minimal bridging, icicles, and micro solder balls; excellent pin testability and cosmetics due to the low-solids, rosin-free formula; and time-saving no-clean processing. ALPHA EF-2210's high electrical reliability for both tin/lead and lead-free applications is supported by its passage of the Bellcore SIR and other key tests, including IPC SIR and Bellcore/IPC Electromigration (EM), and it is ORL0 classified per the IPC J-STD-004. It performs well on most popular PCB fabrication materials. Cookson Electronics, www.cooksonelectronics.com. Booth 443.
Test VehiclesNew packages available in dummy components for test include the Amkor's very thin fine-pitch BGA (PSvfBGA) package-on-package (PoP), test boards, and FusionQuad package combining ExposedPad QFP and MLF for 50% reductions in package sizes per lead count. Practical Components, www.practicalcomponents.com. Booth 2248.
Printer with Integrated AOIThe VERSAPRINT printing platform incorporates line scan technology, LIST cameras for time savings and full post-print AOI on the printing machine. The LIST line-sensor-based camera for alignment and inspection has top and bottom sensors. It scans 260 mm at 35 mm/sec., allowing inspection speeds up to 9,100 mm2. It detects paste-on-pad, print offsets, bridges, and smears. The VERSAPRINT P1 and S1 both include LIST cameras. The P1 also includes triple rail transport (TRT) standard. ERSA North America, www.ersa.com. Booth 624.
No-clean FluxThe NC162 SN100C no-clean flux is a third-generation liquid flux targeting minimal post-process residues in palletized and non-palletized processes. It becomes more robust at higher temperatures. The product is halide-free and lead-free-compatible with high activity and no-clean specifications. FCT Solder, a division of FCT Assembly, www.fctassembly.com. Booth 243.
XRF AnalyzerThe NITON XL3 700 series analyzers provide near-real-time solder-alloy grade identification and lab-type compositional analysis of plastics and polymers. Typical solder screening takes about 5 sec. The XL3t features a 50-kV 2-W X-ray tube for simultaneous measurement of up to 25 samples. The series comes NITON data transfer (NDT) software for data management, certifications and reports, and process monitoring. Thermo Fisher Scientific Inc., www.thermo.com/niton. Booth 2210.
Thermal Process OptimizationFor reflow ovens and wave soldering systems, the Auto-Focus Power option searches for available oven recipes and automatically selects the optimal process for a given application. It based process selection on process window, fastest throughput, and lowest energy consumption. KIC, www.kicthermal.com. Booth 1977.
Integrated Dispense ModuleDispensing glue, solder paste, or both, the iPAG is an integrated dispense module with single or double heads. It applies materials to substrates directly after the printing process. Dispensed deposits then are inspected with the system's EVA technology. EKRA, www.ekra.com. Booth 1845.
Reflow OvenThe flexible RO-VARIO reflow oven suits soldering and curing. Multiple jobs can run in parallel, and multiple transport and support rails can be installed in parallel. A select-and-lock system enables automatic positioning of each rail. One motor drive is required for a complete group of air fans (upper/lower). Other features include reportedly accurate regulation of zone temperature, water cooling, nitrogen inert atmosphere, flux management, and a proprietary air guidance system. The temperature profile can be programmed and regulated to tight limits. RO-VARIO also features RO-CONTROL software. ESSEMTEC, www.essemtec.com. Booth 501.
Surface FinishThe ENEPIG surface finish is designed to be versatile. It is solderable and aluminum- and gold-wire bondable. The finish reportedly exhibits high solder joint reliability with lead-free alloys, particularly SAC. Uyemura, www.uyemura.com. Booth 1273.
Inventory TrackingRFID Smart Reel Detection system uses RFID technology on component reels to improve traceability and eliminate manual barcode scanning. The reel RFIDs can be associated with a selected set of feeders, off-line setup area, or storage location. The tooling complements Cogiscan's Smart Feeder system, and can be used independently or with an intelligent feeder system. It boosts traceability and reduces the impact of human error, according to the company, and supplies automation to the overall data-acquisition process. Cogiscan, www.cogiscan.com. Booth 1910.
Fluid Dispense System Stinger dispense module enables users to dispense SMT adhesives or solder paste onto a PCB on the screen printer, immediately following print. It is coupled to the printer's vision system electro-pneumatically for removal/reinstallation during maintenance and material changeover. The system automatically adjusts dispense tip height with laser compensation on a Z axis. It is field-retrofit capable. Ovation Products, www.grid-lok.com. Booth 2471.
Supply Chain SoftwareThe supply-chain management software, INOKIT, works with storage equipment to minimize machine setup, tear-down, and reload. The software provides visibility of stock and actionable data, and should eliminate liabilities in inventory transactions, when combined with the storage unit. The set condenses inventory processes control, management, and storage into one comprehensive application. Inovaxe Corp., www.inovaxe.com. Booth 2270.
In-line PCB RouterThe Sayaka CT23NP combines low-stress depaneling with faster processing and easier programming, based on Windows image-processing software. A turntable allows the system to process one board and load the next simultaneously. Flexible vacuum pick-up and fixture, automatic alignment by CC camera, efficient dust collector, and safety features are standard. Seika Machinery Inc., www.seikausa.com. Booth 711.
Solder Recovery SystemsEVS 7000 and 9000 will debut, featuring advanced electronic controls and integrated diagnostics. The EVS systems are based on previous-generation 3000 and 6000 solder recovery systems. They offer smaller footprints and single-operation dedrossing of large wave soldering machines. The integrated hopper transfers dross to a waste bin, while multi-part filtration cycles air back into the facility. Dedrossing time is cut by up to 75% for cleaner wave. The machines feature extensive safety controls. EVS International, www.solderrecovery.com. Booth 263, with distributor Sono-Tek.
Rework SystemThe Fineplacer CRS 10 compact rework system suits fixed configuration needs, small- to medium-scale series assembly, or highly precise rework of soldered components on medium- to large-size surface mount device (SMD) boards. A plug-and-work design eliminates the need for time-consuming cabling. Other features include a patented Vision Alignment System (VAS) design with stationary beam splitter, controlled Z-height during reflow, lead-free compatibility, and an automated component place and lift-off function. A Controlled Mixed Soldering System (COMISS) reflow module enables top heating and full-area bottom heating. Placement accuracy up to 10 µm enables placement of small components with pitches down to 100 µm, while a large FOV aligns large components with side lengths up to 45 mm without additional optics. Finetech, Inc., www.finetechusa.com. Booth 557.
Silver- and Lead-free SolderThe Sn/Cu/Ni/Ge solder SN100C is lead-, halide-, and silver-free, suiting wave soldering and (in paste) reflow. It uses a P500 flux medium and can be dropped in to replace SAC alloys in many cases. The solder results in shiny fillets, no shrinkage defects, high ductility, and stable intermetallics, according to the company. The P500 medium suits printing with a long stencil life, good tack, and fast wetting on various substrates and clear residues. Nihon Superior, www.nihonsuperior.co.jp. Booth 249.
Pick-and-Place SystemThe FLX2010-BLV SMD pick-and-place system is part of the high-mix FLX series, offering feeder changeover during operation and 5,000 CPH placement speeds. An integrated feeder-management system recognizes feeders and pickup height automatically. Machine programming can be prepared off-line and optional management information system (MIS) software features stock management, production planning, simulation, and data recording for traceability. The BLV addresses prototyping and series production in batch-style operations. It has automated PCB handling and 50% more feeder capacity than in-line systems, according to the company. Alignment is automatic, and the BLV can hold up to 225 components simultaneously. Essemtec AG, www.essemtec.com. Booth 501.
AOI PlatformThe Flex Ultra HR high-resolution, high-speed Flex AOI platform boasts 5.0-megapixel camera technology. The system offers 40% improvement in imaging resolution over the Flex Ultra, allowing inspection of 01005 components. A new operator user interface (OUI) for the Flex Ultra graphical platform is more intuitive than previous generations, with multiple languages and a translation option. CyberOptics Corporation, www.cyberoptics.com. Booth 611.
Lead-free-compatible ESD Stencil WipesGREEN MONSTER is an ESD stencil-wiping roll that is lead-free compatible. The roll uses coarse fibers and a porous weave to remove solder paste from SMT stencils. Antistatic, the product prevents sparks during wiping. It uses coarse, long ESD fibers to produce a reportedly aggressive cleaning surface and voids to collect solder paste. Highly cross-linked acrylic polymers bond these fibers into a porous fabric that can be used with vacuum systems on printing machines. It is said to avoid smearing paste, voids in traces, and component damage. High-Tech Conversions Inc., www.high-techconversions.com. Booth 2085.
Dual-gantry Placement SystemThe Xpress 25 flexible high-volume SMT placement system combines high-speed and fine-pitch capabilities. It has twin heads to place an array of devices from 0201s to 50- × 50-mm QFPs at a 0.144-sec. tact time, 25,000 CPH. The system is equipped with smart nozzles, intelligent feeders, and on the fly vision. Xpress 25 has an accuracy of 0.06 mm (QFP) to 0.1 mm (chip) at 4 sigma. It will be demonstrated in dual-gantry operation. Europlacer, www.europlacer.com. Booth 1624.
Stencil-cleaning DetergentFor manual cleaning of SMT stencils and related tooling, 440-R SMT Detergent is verified for specific parameters of environmental and user safety, and cleaning efficiency by the U.S. EPA's Environmental Technology Verification Program. The water-soluble detergent reportedly improves print production, contains no VOCs, and eliminates noxious odors. SMT Detergent Corp., www.smtdetergent.com. Booth 1664.
NOR and NAND Programming SystemThe Flashstream Vector Programming System, a four-socket manual device, is equipped with a proprietary Vector Engine, offering flash programming of NAND or NOR. Vector Engine uses a co-processor design to accelerate flash memory waveforms. Faster speeds are achieved using synchronous operations that eliminate dead times when a DUT waits on the programmer. For memories up to 32 Gbit, the system has an upgradeable RAM. BPM Microsystems, www.bpmmicro.com. Booth 2245.
Rework FluxThis high-performance no-clean rework flux addresses the soldering, reliability, and cosmetics requirements for both lead-free and tin/lead rework applications. ALPHA EF-6100-R was developed to deliver excellent rework soldering performance combined with high reliability and board cosmetics. It was formulated with a proprietary mixture of activators and solvents to help the flux continue working during the longer, hotter processes associated with lead-free rework. Certain ingredients limit its spread, while resulting in a clear matte finish. Its fast wetting action, in a variety of lead-free and tin/lead rework processes, targets flexibility and performance. ALPHA EF-6100-R exhibits electrical reliability for a low-solids wave soldering flux and complies with IPC-J-STD-004 SIR, Bellcore SIR, Bellcore ECM, JIS ECM, and JIS SIR reliability standards. It is available in pens or as a liquid for spraying or dipping. Cookson Electronics, www.cooksonelectronics.com. Booth 443.
PCB Handling SystemsThe transfer and workstation conveying systems at APEX will feature independent variable speed per drive, ESD work surfaces with ground straps, check/pass mode selection, various release features, and other options. Loading, unloading, turn, and flip units include thin-film touch panels, automatic or manual operation, and other standard features. PROMATION, www.pro-mation-inc.com. Booth 2271.
To see even more APEX previews and new products, check out SMT's March issue.