-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Nihon Superior, University of Queensland Collaborate
March 10, 2008 |Estimated reading time: 1 minute
OSAKA, Japan Nihon Superior Co. Ltd. is collaborating with the University of Queensland (Australia) in the investigation of the growth and properties of the intermetallic compounds that form between solder alloys and the soldered substrate. The company sponsors research on lead-free solder at the university.
The intermetallic layer that will be the subject of this investigation has long been known to have a major effect on the strength and reliability of the soldered joints that provide the essential connections in electronic circuitry. New solder joint reliability issues with lead-free solders will be the subject of the new research. The project will begin in April 2008 and is expected to continue until March 2012 with Nihon Superior providing around $313,000 (AU) each year over that period.
Nihon Superior began another cooperative research project with the University of Queensland in April 2006 and that project, on the solidification behavior of solders, is still under way. As the transition to lead-free solders has proceeded, Nihon Superior has realized that it is necessary to study not only the solder alloy itself but the performance of the joint formed with the solder. The University of Queensland has been recognized around the world for their research on the solidification of light metals and the skills developed in that work have been found to be very useful in the study of solder alloys.
For more information, visit www.nihonsuperior.co.jp.