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IPC/JEDEC Plan March Reliability Conference
March 7, 2008 |Estimated reading time: Less than a minute
RALEIGH, N.C. IPC and JEDEC will present the International Conference on Reliability, Rework, and Repair of Lead-free Electronics, March 1112, 2008, in Raleigh. This conference was planned to address the issues faced as a result of implementing a lead-free process, such as alloy choices, component compatibility, and solder concerns.
Courses will be held on March 12, including topics such as rework for dummies (a hands-on experience), lead-free solder joint reliability, interconnect failure and design for reliability (DfR), and reliability issues with lead-free soldering. Nihon Superior Co. Ltd. and DfR Solutions are presenting a paper titled "Accelerated Reliability Testing of Ni-Modified SnCu and SAC305."
The conference will have representatives from Trace Laboratories, CRANE, Intel, OK International, IHS International, Foresite, Inc., BEST, STI Electronics, Nihon Superior, and many more sharing their company's experiences.
For more information or to register, visit www.ipc.org.