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Pre- vs. Post-reflow AOI Debate at APEX
March 5, 2008 |Estimated reading time: 1 minute
LAS VEGAS Pamela Lipson, Ph.D., CEO, Imagen Inc. (Cambridge, Mass.) and Lyle Sherwood, VP and technical director, Landrex Technologies (Santa Clara, Calif.) will debate the impact of inspection pre- or post-reflow for electronics assemblers at APEX, April 13 in Las Vegas. Resources generally limit facilities to using inspection systems at select stages in manufacturing. Lipson and Sherwood will discuss the merits of deploying AOI prior to reflow (in-process) or after (end of line).
The paper and presentation, titled "To Be or Not to Be (Before Reflow): That is the Question (In AOI)" is slated for Tuesday, April 1, 2008. Lipson and Sherwood's paper presents the results of a study at a manufacturing site in the U.S. that contrasts post-place inspection to find and correct defects, and also to perform process control, against post-reflow inspection to find defects at the end of the line. The paper will quantify and contrast the benefits and drawbacks of each type of inspection alone, and will also discuss any synergies between the two inspection strategies.
A high-performing post-reflow AOI machine can inspect all fault types, solder-related and component-level, at the end of the line, notes Lipson. "At this point all boards can be manually fixed and some coarse level, time-delayed information can be fed back to the in-process side," she explains. Finding faults at this late stage in the process will cost assemblers more, however, as several boards will be faulty before the problem is detected.For more information on the technical session, visit www.goipcshows.org, or see www.landrex-us.com and www.imagen-inc.com.