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Review: Printed Circuits Handbook
December 31, 1969 |Estimated reading time: 3 minutes
The sixth edition of the Printed Circuits Handbook maintains editorial continuity with the five preceding issues, with editor-in-chief Clyde F. Coombs, Jr., continuing to determine content. With 16 parts, the Printed Circuits Handbook is designed for general reference engineers experiencing a connector issue may read “Nonsolder Interconnection” to find a solution; EMS providers sourcing products and equipment, or troubleshooting production runs, should use the Handbook as a base-line of knowledge on metallurgies, soldering methods, etc. It covers all types of printed circuits: rigid, flex, multilayer flex, rigid-flex, non-solder connectors, and complex packages. The guide systematically explains PCBs from design through fabrication, inspection, and rework, with additional material on the industry’s concerns, emerging technologies, and perspectives. A summary of industry standards and glossary in the appendices offer at-a-glance citation.
This edition begins with a section exploring lead-free legislation, an indication of the profound effect lead-free has had on our industry. RoHS, WEEE, and other government initiatives are examined. Further chapters delve into quality issues, peak temperatures for lead-free, impact on base materials, lead-free packages, and other concerns for assemblers transitioning some or all their processes to lead-free.
Beyond the lead questions, an “Environmental Issues” section suggests pollution prevention techniques, methods for treating chemicals, recycling regimens, and other holistic environmentally conscious production initiatives.
Modern technological drivers for PCBs go beyond lead-free, and the Printed Circuits Handbook deals extensively with high-density interconnect (HDI) and emerging package types. Upstream from PCB assembly, emerging package types like system-on-package (SoP), optoelectronic modules, chipscale packages (CSPs), and multichip packages (MCPs) affect board layout, assembly reliability, production requirements, and materials selections for the final product.
Two other sections caught our attention as particularly important for even seasoned PCB assemblers to read one being PCB design for thermal performance, speaking to the growing problem of thermal management; and the other embedded components, a technology surging ahead in the necessity for smaller, more functional, more reliable products in most sectors. Printed Circuits Handbook, Sixth Edition is available from The McGraw-Hill Companies, New York, mhprofessional.com.
Professor Ramkumar Joins SMT Advisory Board
ROCHESTER, N.Y. S. Manian Ramkumar, Ph.D., faculty professor and director at the Center for Electronics Manufacturing and Assembly, Rochester Institute of Technology (RIT), joined the SMT Editorial Advisory Board, representing academia and research. Ramkumar helped orchestrate SMT and RIT’s joint conference “Implementing Lead-free” in 2006. He teaches courses in surface mount electronics packaging and manufacturing automation, and was instrumental in developing the Center for Electronics Manufacturing and Assembly.
The Center is equipped with assembly and failure analysis equipment to support hands-on training and applied research projects for industry. Ramkumar has been the principal investigator for several applied research projects. He has presented technical papers at SMTA, APEX, IMAPS, and ECTC conferences. Professor Ramkumar also teaches SMT and advanced packaging courses at IPC and SMTA shows and on-site for various companies. Look for his editorial columns regarding in upcoming issues and e-newsletters.
December Book-to-Bill
The combined rigid and flex PCB industry book-to-bill for North America slid to 1.01 in December, according to IPC. While this remains positive, indicating growth in the coming months, both the rigid and flex segments saw lower book-to-bill ratios than in preceding months, at 1.01 and 1.00, respectively.
- Shipments for rigid PCBs were down 5.9% from December 2006; and bookings increased 6.8%. Compared to November 2007, billings drove up 8.0% and bookings increased 3.1%.
- Flexible circuits shipments rose modestly, 1.0%, and bookings fell 9.7% from December 2006. Compared to the previous month, flex shipments rose 5.6% and bookings climbed 2.2%.
- Combined, the flex and rigid PCB market dropped 5.4% in billings and picked up 5.5% in bookings from the same month the previous year. Compared to last month, shipments of flex and rigid PCBs climbed 7.8%; combined bookings rose 3.1%.
Report: $2 Trillion Electronics Market
WELLESLEY, Mass. BCC Research reports that the world market for electronics products hit $1.8 trillion in 2006, leading to predictions of a $2 trillion result for 2007. BCC’s forecast, “Global Electronics: High-growth Products and New Markets,” predicts a 9.5% CAGR over the next five years, driven by consumers in developed nations upgrading and consumers in developing economies purchasing electronic goods for the first time. The global electronics market will reach $3.2 trillion in 2012 at this pace. A growing number of global companies design, brand, and/or manufacture electronics products, BCC observes, and most geographic regions are rapidly accelerating electronics manufacturing and electronics consumption. This is particularly true in the Asia-Pacific. The forecasting firm lists enterprises that shaped the electronics industry during recent decades, as well as those currently creating electronics products.
BCC identifies industrial electronics as the largest market sector, accounting for 39.6% of total revenues. Computer products grab 20.0% share, followed by semiconductors, consumer electronics, and communications electronics. Automotive electronics take up a small slice of total revenue, 2.6%.
For more information on “Global Electronics: High-growth Products and New Markets,” visit www.bccresearch.com.