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BiTS 2008 Workshop Approaches
December 31, 1969 |Estimated reading time: 3 minutes
By Frederick Taber, BiTS Workshop
MESA, Ariz. The ninth annual Burn-in and Test Socket Workshop (BiTS 2008) is just around the corner, March 912, in Mesa. BiTS Workshop and EXPO is dedicated to providing a forum for the latest information about burn-in and test socketing, and related fields to participants from around the world. These participants represent end users and suppliers of sockets, boards, burn-in systems, handlers, packages, and other related equipment, materials, and services.
The Technical ProgramLeaders in advanced packaging technologies Karl Johnson, Ph.D., and Belgacem Haba, Ph.D., deliver important talks on semiconductor packaging.
Johnson, VP and senior fellow, Advanced Packaging Systems Integration Laboratory, Freescale Semiconductor, Inc., will deliver BiTS's keynote address on Monday, March 10. His talk, "Packaging & Assembly in Pursuit of Moore's Law and Beyond," emphasizes that "packaging can no longer be thought of as a back-end process largely independent of the silicon and product," noting that they "have become an integral component in the overall performance, figures of merit, and cost competitiveness of new generations of products." He will address the challenges, trends in packaging and assembly, and some solutions in development and implemention stages for this area.
Haba, fellow and chief technology officer (CTO) of advanced packaging and interconnect, Tessera, Inc., presents "Catching the Mobile Wave: Packaging is Going 3D" on Sunday, March 9. Haba points out that "hand-held communication and entertainment products will continue to dominate the consumer markets worldwide," and with consumer expectations of more features in smaller packages, "system-level integration and miniaturization becomes more of a priority." He'll discuss different alternatives available for 3D packaging and some ideas for the mobile market.Beginning at noon on Sunday, March 9, are two special tutorials, where attendees can build skills by learning more about CMOS semiconductor reliability and gaining a deeper understanding of intellectual property (IP). Each is taught by a leading industry expert. Ann Swift, IBM Microelectronics, will lead the "Basic Chip Reliability Concepts" tutorial. She has more than 25 years of experience in reliability and quality matters, and currently is responsible for the reliability of new products introduced in leading-edge technologies at IBM.
Ira Blecker, Esq., will teach "Intellectual Property: What Is It and What Do I Do with It?" Blecker is the attorney of record on nearly 500 granted patents which includes extensive work in the semiconductor, packaging, and test/burn-in arenas. He operates a private law practice.
The technical presentations program features nearly 30 papers, plus two Posters Sessions, which are being held for the first time at BiTS, with 11 authors presenting posters.
The presentations and posters are organized into 10 sessions across two and a half days; with a daily theme. Presenters from around the world will share their latest work on topics related to test and burn-in socketing and associated areas. March 10 is "Operations Day;" March 11 will be "Challenges Day;" and March 12 will host "Design Day." With a single track, choosing the sessions to attend is easy and attendees have the opportunity to attend all presentations. Networking opportunities exist throughout the conference, allowing attendees the chance to relax and share experiences and ideas.
BiTS EXPOAt the BiTS EXPO, over 50 companies from around the world will be exhibiting their latest products and services. Exhibits hours are Monday, March 10, 6:00 to 9:30 PM, and Tuesday, March 11, from 4:00 to 6:30 PM.
RegisterAdvance attendee and tutorial registration may be made online through February 22 at www.bitsworkshop.org. For advance registration by mail or fax, download the registration form from the BiTS Website and submit to the BiTS Registration Office (registration2008@bitsworkshop.org; (979) 846-6800). After February 22, attendees can register on-site. The BiTS Workshop is produced by BiTS Workshop, LLC. Advanced Packaging and Connector Specifier Magazines are the exclusive media sponsors of the BiTS Workshop.