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Q&A with Brian Duffey, MYDATA
December 31, 1969 |Estimated reading time: 4 minutes
Gail Flower, editor-in-chief, speaks with MYDATA's Brian Duffey about modern pick-and-place, including carts, feeders, and customer needs. Duffey explains the development of high-mix assembly, and what constant changeovers neccessitate from a pick-and-place perspective.
Q: What are some of the latest features that customers expect from pick-and-place companies?
We see customers having a strong focus on improving productivity, not only by higher line throughput, but also by software integration, automating material handling, logistics, and traceability. We also know that customers expect to achieve higher throughput at a higher level of mixed manufacturing than before. To reduce the number of operators required per line, customers also expect the system software to become more intelligent and user-friendly.
Q: What type of vision system/s do you use for placement?
We offer the Linescan Vision Camera (LVC) for high-speed performance. LVC is an optional high-speed positioning system that provides the ideal solution when mount speed is critical. It is able to inspect and align fine-pitch components with sub-pixel precision on-the-fly, at up to 2 m/sec. The LVC generates 4 megapixels of data with each image and ensures accurate placement of all leaded and BGA-type components with lead widths as low as 0.10 mm and bump diameters of 0.15 mm.
Our Dual Vision Camera (DVC) targets accurate placement of a wide range of components. It comes standard with MY-Series machines and delivers excellent placement results. The two camera approach speeds up and simplifies inspection and optical centering, and also ensures best-fit placement of large and small components. Equipped with programmable lighting in the cameras, the DVC ensures optimal illumination for all package types. This feature, together with high-resolution, means the DVC can inspect large and small components, as well as fine pitch or complex packages, without losing detail or precision. The DVC handles lead widths as low as 0.05 mm and bump diameters as low as 0.08 mm.
The MYDATA product line also includes Autoteach, a function that can create new package definition in seconds. The unknown package is shown to the vision system and all geometrical data is measured automatically. This includes the position of the leads, lead width, ball diameter, and pitch. Even if the component is imperfect, lead positions will be fine-tuned to fit a standard pitch, which eliminates measurement errors.
Q: How do you handle equipment maintenance?
A MYDATA machine has a long lifespan. Machines produced 16 years ago are still turning out products at the same rate as they did when they were new. We offer preventive maintenance programs that cover all scheduled preventive maintenance as well as replacement of parts before they wear out. We supplement this with technical support, applications support, and training services that can help keep our customer's productivity up and minimize downtime so they can avoid lost production revenues due to unplanned stoppages. MYDATA has a network of more than 100 service engineers on call, operating out of about 30 front-line local service offices globally. These engineers are trained and certified by MYDATA, with annual updates in new products.
Q: Why target mixed-assembly placement providers?
The first MYDATA machine, in the early 1980s, answered a need for a flexible surface mount solution for short-batch production in a high-mix environment. Twenty years later, our R&D strategy remains focused on finding ways to speed up changeovers, which is essential to achieve an efficient mixed-assembly process. Therefore, we develop flexible platforms that handle a wide range of components and boards. Our smart feeder system also enables fastest changeover times. Since flexible has become a buzz word that's lost its meaning, we like to talk about "True SMT Flexibility." This is our customers' actual throughput, smart feeder systems, full range of component handling, any shape or size PCB handling, an integrated software suite, customization, and customer support.
Q: How do you maintain pick-and-place speed in a mixed-assembly environment?
The MYDATA pick-and-place machines, software solutions, and accessories were designed from the beginning with mixed assembly in mind. For example, our product range of smart Agilis feeders allows for changeovers while production is running. Also, the machine software continuously optimizes the placement routine whenever the prerequisites change. Both of these features keep the machine running at all times in the most efficient way possible.
Q: What defines MYDATA's carts and feeders?
While everyone today talks about "intelligence," at MYDATA we call our Agilis feeders intelligent because all our magazines and feeders have their own specific identity. This enables the machine software to recognize the presence, absence, and location of components automatically. The result is that you never have to program pick positions and can replenish feeders while the machine is mounting. If a feeder runs out of components, production doesn't stop. Instead, the machine alerts the operator, re-optimizes, and continues mounting other components. With the dedicated barcode system, you can achieve higher levels of quality and intelligence. The system helps track component and inventory data, such as batch ID numbers and quantity levels. And because barcode scanning eliminates manual entry during loading and unloading, setups and changeovers are faster.
We released the Agilis Stick Magazine (ASM) for quick loading and reliable feeding of stick components. Unlike stick feeders that rapidly vibrate up and down to feed components, the ASM uses a high-precision, short-stroke linear drive with a servo-controlled, horizontal motion. This reliable feeding process significantly reduces time and money spent on operator assists and component waste. The ASM handles a range of SMT components small TSSOPs to large PLCCs and high connectors. All feeding settings are generated from component data automatically.
Q: In what format are most components fed to pick-and-place equipment (waffle, sticks, and tapes)?
While tape is still the dominant format in all types of SMT assembly, stick and waffles tend to occur more often in high-mix production due to lower purchase quantities.