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Professional Development at APEX
January 28, 2008 |Estimated reading time: 1 minute
BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries will promote reliability in lead-free, high-density interconnects (HDIs), design for reliability (DfR), and other topics for more than 60 professional development courses March 3031 and April 3 at IPC Printed Circuits Expo/APEX/Designers Summit in Las Vegas. Courses are half- and full-day classes with expert speakers.
Highlights include "Roadmap to Regulatory Compliance: Risks, Challenges, and Opportunities for the High-tech Industry," detailing the process of transitioning production to meet environmental regulations; "How to Specify PCBs to Reliably Survive the RoHS-mandated Lead-free Soldering Processes," taking the reliability angle of lead-free production; "Lead-free for the Exemptee Surviving in a Lead-free World," which will target medical, military, and other specialist manufacturers trying to source tin/lead parts and maintain a leaded process; "Achieving High-reliability for Lead-free Solder Joints Material Considerations;" and "Rapid RoHS Assembly Development for Large and Small Boards in a RoHS environment," in the lead-free/RoHS space.
Beyond RoHS and environmental concerns, highlighted courses include "True Design for Reliability: Understanding What Is and What Is Not DfR," for those interested in building reliability into the PCB early in the process; "What is HDI? Do You Need HDI? How To Get Started," covering high-density products; and "Implementing 'Bleeding Edge' Component Technology," for next-generation designs taking advantage of advances in components.
For the full course selection, visit www.goipcshows.org or contact Alexandra Curtis at (847) 597-2877; alexandracurtis@ipc.org.