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TechSearch Lauds Embedded Components
January 25, 2008 |Estimated reading time: Less than a minute
AUSTIN, Texas TechSearch International released "Embedded Active Components and Integrated Passive: Technologies and Markets," a report detailing the technologies, processes, and infrastructure for embedded components. TechSearch expects embedded components to see double-digit growth across market segments in coming years.
Formed and placed embedded components in printed circuits packages or PCBs can reduce product costs, enable more features, reduce size, and improve performance, according to TechSearch. The technique also helps lower product weight, and can improve reliability and reduce solder joint counts. These elements promote embedded designs for military and medial, consumer and mobile, and automotive applications, TechSearch reports.
Consortia and development activities are global, particularly vibrant in Europe, the U.S., and Japan. TechSearch's study examines demand for formed and placed embedded components by market and application, technical solutions, materials, and infrastructure of design and assembly equipment and services for embedded products. It also tracks the development of various embedding strategies and the influence of microvias.
TechSearch will host a workshop February 2526 in Austin, with speakers from materials suppliers, fabricators, and embedded component users. For more information, see www.techsearchinc.com.