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IPC Calls for Midwest 2008 Papers
January 24, 2008 |Estimated reading time: 1 minute
BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries issued a call for participation for the IPC Midwest Conference & Exhibition, September 2328, 2008, in Schaumburg, Ill. Researchers, academics, technical experts, and industry leaders are invited to submit an abstract for the technical conference on any aspect of electronics manufacturing.
Expert presentations are sought on eco-compliance, including REACH, halogen-free technology, and RoHS. Another key topic will be board design, covering embedded passives, advances in CAD/CAM, and fine-pitch design; board materials, like new laminates, materials testing, and high-frequency laminates; and board fabrication, including advances in plating technology, flex and rigid-flex, and via formation and fill. IPC also seeks presentations on assembly technology, solder joint reliability, rework and repair, high-density assembly, and backward leaded/lead-free compatibility.
Abstracts are due by April 11, 2008, and should include case histories, field data, and new technologies or innovations or research and findings. They should summarize problems and resolutions, methods used, results of experiments, and benefits to the industry.
IPC Midwest also will offer professional development courses. Proposals are solicited from individuals interested in teaching full- or half-day courses on design, or PCB or electronic manufacturing processes and materials. Proposals, including course descriptions, must be submitted by April 11, 2008.
For more information, visit www.ipcmidwestshow.org or contact Alexandra Curtis, IPC professional development manager, at (847) 597-2877; curtal@ipc.org.