-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Submit for 3D/SiP Advanced Packaging Symposium
December 31, 1969 |Estimated reading time: Less than a minute
The SMTA is extending the deadline for abstract submissions for the 3D/SiP Advanced Packaging Symposium through January 24, 2008. Interested applicants should send a 200300-word abstract to the conference coordinator, Melissa Serres.
Abstracts can be submitted via e-mail as a Word document attachment to melissa@smta.org. There will not be a technical paper requirement for this program. Submissions should include: name, company, mailing address, telephone, fax, e-mail, and presentation title.
The 3D/SiP/Advanced Packaging Symposium will be held April 2830, 2008, at the Washington Duke Inn in Durham, N.C. This symposium will provide up-to-date research in the field of advanced packaging with particular attention to materials, manufacturing, assembly, and package/PWB reliability in a lead-free environment.
Specific subject areas include, but are not limited to, system-in-package (SiP), multi-chip packaging (MCP), materials/finishes/solder alloys, reliability, package-on-package (PoP), enabling technologies, die stacking/3D assembly, wafer-level packaging (WLP), bumping/flip chip on board (FCOB), handheld electronics/miniaturization, 3D wafer-level integration, 3D WLP, die/package/system co-design, modeling and simulation, drop/shock/bend performance, and infrastructure.
For more information, visit www.smta.org or contact the SMTA at (952) 920-7682.