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Indium's Ning-Cheng Lee Presents Globally
January 7, 2008 |Estimated reading time: Less than a minute
CLINTON, N.Y. Ning-Cheng Lee, Ph.D., VP of technology at Indium Corporation, will present diverse workshops in Thailand, Malaysia, and India throughout January 2008. Topics range from environmental impacts to high reliability, and center around lead-free soldering.
Indium and Fusion Advantec will present a full-day workshop, "Environmentally Friendly Packaging and Assembly," January 18 in Bangkok, Thailand. Lee will delineate challenges for electronics miniaturization and wave soldering. To register, call +66 02965 8006 or e-mail asiapac@indium.com.
In Penang, Malaysia, Indium will host "Future of Lead-free Solder Alloys and Fluxes," presented by Lee. The workshop will take place on January 22. To register, call Sehar Samiappan at Indium: +60 12 4839314; ssamiappan@indium.com.
Indium will co-present "Achieving High Reliability for Lead-free Solder Joints" with Spur India, January 24 in Chennai, India. The workshop explores electronics reliability and materials considerations. Interested attendees should contact Liya Koorithodi: +91 44 43 552 662; lkoorithodi@indium.com.
Ning-Cheng Lee, Ph.D., is a soldering expert and SMTA Member of Distinction with experience in high-temperature polumers, microelectronics encapsulants, underfills, and adhesives. Current research covers advanced materials for interconnects, advanced packaging, and optoelectronics packaging.
For more information, visit www.indium.com.