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NEWPRODUCTS
December 31, 1969 |Estimated reading time: 3 minutes
Reel-to-reel Printer
The Reel-to-Reel (R2R) printer targets precision printing onto continuous substrates, such as flex circuits; organic LED substrates; non-conductive materials; and other foils, papers, and composites. Using a step-and-repeat process, the printer processes materials up to 150 m × 500 mm. It replaces conventional board transport with three vacuum beds and a clamping system, and is said to drive up handling efficiency and throughput with large substrates. DEK, Weymouth, U.K., www.dek.com.
Large-board Component Placement
The GC-30S high-speed and GX-11S multi-function Genesis placement platforms handle large PCBs on a reportedly compact machine footprint. The pick-and-place systems suit NPI, low- and high-volume, and high-mix environments, accepting varied board sizes up to 813 × 610 mm. The GC-30S has a 30-spindle Lightning head for components up to 30 mm2; the GX-11S uses seven-spindle and four-spindle in-line heads to place odd-form and multi-function components. Universal Instruments Corporation, Binghamton, N.Y., www.uic.com.
Odd-form Placement Platform
The IQs odd-form component placement system is a lower-cost model in the IQ series. It features proprietary PIE 3D-compliant grippers, a single-pin clinching mechanism, and the Adept Cobra s600 robot. The system is said to increase throughput while reducing electrical integration costs and cycle times. It is compatible with the full line of component feeders. CHAD Industries, Anaheim, Calif., chadindustries.net.
Updated Debug/Test Software
XJTAG version 2.0 automates JTAG boundary scan test setup and allows simpler categorization of non-JTAG/cluster devices through a drag-and-drop feature. It includes a built-in netlist explorer, improved memory test, real-time DfT coverage analysis, a larger library, better integration with LabVIEW, and support for Xilinx’s Virtex-5 FPGA system monitor. The XJEase programming environment was enhanced, and the system hosts XJAnalyser, XJRunner, XJLink, and XJDemo software. Users can record, refine, and repeatedly use test IP throughout the development cycle. XJTAG, Cambridge, U.K., www.xjtag.com.
Fast-cure Adhesive
Curing at room temperature in 3-5 min., Supreme65HT-6 two-part epoxy adhesive adheres to metal, glass, ceramics, and plastics. It offers tensile lap-shear strengths above 3,000 psi. The material reportedly resists thermal shock, vibration, and stress fatigue cracking, and demonstrates epoxy-resins’ moisture, creep, corrosion, and thermal resistance properties. It maintains these characteristics from -62° to +204°C. Master Bond, Hackensack, N.J., www.masterbond.com.
Sensor Component
OPB609-series reflective-object sensors comprise an IR LED and NPN silicon phototransistor mounted side-by-side on parallel axes in a axial, gull wing, or right-angle lead configuration. The components include an opaque black plastic package, which is said to minimize costs and enhance sensing of diffuse surfaces. The epoxy package is spectrally matched to IR emitter λ = 940 nm, cutting wavelength under λ = 840 nm. The sensor is unfocused with high-speed phototransistor output. The phototransistor operates with 30 V collector-emitter voltage and emitter-collector voltage at 5 V. The LED’s maximum forward voltage is 1.7 V; reverse DC voltage hits 5 V. The component operates between -25° and +85°C in assembly line and automation systems, safety products, and other detection applications. OPTEK Technology, TT electronics, Carrollton, Texas, www.optekinc.com.
UV Cure Lamp
The Ultra Light advanced UV curing station delivers 400 W/in. UV power, with a design that incorporates waste light energy from the lamp housing to boost UV power by 20%. It cures inks, adhesives, and coatings. The unit is controlled by touchscreen and includes safety features in the switches and control panel, along with non-conductive and grounded cabling and internal temperature sensors. It can run iron-additive and standard mercury-vapor lamps. Systematic Automation Inc., Farmington, Conn., www.systauto.com.
Sockets Catalog
With 144 pages, including 50 reference pages, Catalog 16 offers surface mount and thru-hole IC sockets, connectors, and adapters for various test, validation, and production tasks. The catalog’s reference section includes screw-machined terminal and BGA footprints. RoHS-compliant insulators and terminal plating options are included. The catalog shows next-generation 0.50- and 0.65-mm-pitch BGA socketing systems, BGA interposers for converting lead-free packages into tin/lead assemblies, low-profile SMT strip connectors, and other products. Advanced Interconnections Corp., West Warwick, R.I., www.advanced.com.
Immersible Conformal Coating
Liquiguard water-based conformal coating protects electronics assemblies from electrical damage when completely submerged in liquids. It adheres to PCBs and components in a 1-mil film, and reportedly provides heat dissipation and ease-of-rework along with moisture and harsh environment protection. Liquiguard Technologies, Ft. Lauderdale, Fla., www.liquiguard.com.
Military-spec Power Inductors
The series MIL4922 high-current SMT power inductors are qualified to DSCC specification sheet MIL-PRF-27/367 for military and aerospace applications. The components are available with tin/lead termination finishes, packaged in tape-and-reel. They range from 0.22 to 22,000 μH inductance and 0.05- to 7.00-A current ratings, and operate between -55° and +130°C. Laser marking enables identification and traceability. API Delevan, East Aurora, N.Y., www.delevan.com.