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2008 INDUSTRY FORECAST
December 31, 1969 |Estimated reading time: 26 minutes
This article represents a collection of viewpoints from industry leaders. 2007 brought tighter economies, adjusting markets, buyers and sellers. Most believe 2008 will be busy with NPIs. Everywhere environmentally friendly products abound. Miniaturization and integrated packages became the latest frontier.
Zierick Manufacturing Corp.
Janos Legrady, VP of R&DIn the first half of 2007, Zierick showed moderate growth. Since we introduced next-generation surface mount insulation-piercing crimp terminals and the termination system, activity in sales increased significantly. Because of this product focused on economical, compact wire termination for SMT boards, and other additions to our SMT product offerings, we anticipate growth in 2008.
Zestron
Harald Wack, Ph.D., executive VPZestron expanded capabilities by adding products and personnel, and by upgrading to a new facility. We anticipate a rise in demand for high-precision cleaning products in 2008. The new Worldwide Center of Competence and Excellence for Inline Cleaning Processes features top inline processes for customer tests. FAST surfactant technology was introduced in 2007 to increase agility on a molecular level, speeding removal of flux residues. Our facilities in Shanghai will move to a larger site by 2008. In Europe, we invested in a $5M facility, opening in fall 2008.
YESTech Inc.
Don Miller, presidentJoining Nordson’s Advanced Technology Group, which includes Asymtek, EFD, March Plasma, and Dage Precision Industries, was certainly the biggest news for us in 2007. In 2008, we foresee continued growth for YESTech, especially in China, where we plan to augment infrastructure and resources to serve the local base. We’ll also release the next-generation X series automated x-ray systems.
WKK
Hamed Al-Abd, president2007 was not a particularly good year for the SMT market, mainly due to high equipment purchasing in 2006. Furthermore, 2007 has seen the North America economy soften, which affects China manufacturing. I expect 2008 sales growth in North America as more North American PCB assemblers learn about our company and products. Our goal is to help them be competitive and profitable.
VJ Electronix, Inc.
Don Naugler, GMVJ Electronix saw higher demand for Summit and PMT rework systems, and applications development for rework and X-ray. Manufacturing focused much of Q’02 and Q’03 2007 on enhancing our supply chain. For rework, we introduced tooling and processes for miniature to complex components. For X-ray, we’re addressing inspection requirements from high-I/O BGAs to medical components and solar cells. In 2008, we expect a rapid push for new components, such as PoP, larger boards, and new substrates, so we’ll bolster R&D and applications support.
Viscom Inc.
Carsten Salewski, CEOViscom is constantly striving to become the top global inspection equipment provider, and 2007 was a year of high activity. We launched the X7056 combo machine, a parallel AOI/3-D X-ray inspection system, and EasyPro3D programming software. We also opened San Jose, Calif.; and Guadalajara, Mexico, offices. Sales were slow in Q’02 2007, but Q’03 and Q’04 were solid. In 2008, we will be introducing more products and pursuing growth.
Victrex
Terri Jordan, global marketing manager; and Christine Karas, GM, AmericasMiniaturization and densification were strong trends in 2007, leading to smaller line widths and footprints. This drove up demand for high-purity polymers and high-temperature materials that could flow around low-stand-off components. Lead-free also requires high-temperature polymer chemistries, and will continue growing in 2008. We plan to specify into new applications areas in 2008, while improving core products. Carriers, test sockets, and end-products such as mobile phones and high-quality printers will be major sectors.
Test Research, Inc. (TRI),
Wen-Yen Lin, manager, global marketingIn 2007, we improved our existing range of solder paste inspection, ICT, and AOI systems. We became an approved vendor for major computer, communications, and automotive customers. We also expanded from an Asia base into the Americas and Europe. TRI plans a 2008 launch for an in-line 3D AXI system and an AOI system for bare PCBs. We’ll also look to add strategic partners and industries.
ScanCAD International, Inc.
William F. Loving, presidentScanCAD is focused from 2007 through 2008 on a pre-production inspection trend, highlighting our virtual product inspection (VPI) system. ScanINSPECT confirms in advance that all variables will be successful prior to production, eliminating common problems that arise in NPI or product change-over.
RMD Instruments
Steve Glass, WEEE/RoHS business development managerRMD enjoyed its most sucessful year in 2007. With the LeadTracer-RoHS analyzer’s debut, we experienced a 375% increase over 2006, and will move into 2008 with an order backlog. We solidified our brand by establishing a complete global distribution base. We have considerable optimism about how the electronics manufacturing industry will embrace our products in 2008.
R&D Technical Services
David Suihkonen, presidentIn 2007, R&D Technical Services focused on developing product rollouts. The industry had a hard time making up its mind on whether to grow or stay flat. We were either running at 110% or nearly stopped. Middle ground seemed hard to find in 2007. Hopefully, the industry will lose a bit of its schizophrenia and move forward at a more consistent rate in 2008. We will be watching for signs of confidence, stability, and growth.
Qualitek International, Inc.
Debbie Liguori, marketingThere is always a lot happening at Qualitek; we expanded the product line with JT NSM wave solder machines, JT VS/NS 800-1000 reflow ovens, and an accessories line for Asia plants. We improved on our existing tin/lead and lead-free solder pastes and other formulations and acquired another lead-free alloy, SN100e, which is cost-effective against SAC. Low-alpha materials also joined the portfolio in 2007.
PROMATION Inc.
Gary Goldberg, president and CEOPROMATION released a series of PCB handling equipment in 2007, designed to meet customer’s fiscal and performance requirements. The E-Series rounds out the line of PCB handling solutions with a low-cost option. We introduced a range of tabletop laser-marking systems that can operate on most standard software platforms. In 2008, additional focus will be placed on creating and bringing to market high-value/cost-effective products.
Practical Components Inc.
Kevin Laphen, presidentPractical Components focused on global markets during 2007, adding Asia-based and global distributors. As assemblies increase in complexity and decrease in size, demand for higher-technology dummy components, such as stacked packages and thin-substrate CSPs, rises. In 2008, we believe lead-free materials will play an important role in our markets, especially for training and certification, and SAC experimentation.
Photo Stencil, Inc.
Keith Favre, president and CEOIt has been an eventful year at Photo Stencil, with our acquisition by Kachi Partners and my appointment as president and CEO. We have enjoyed strong growth, particularly with our AMTX stencil line and squeegee blades, and are expanding capacity and R&D. There are some macroeconomic uncertainties that we will all face next year; however, we still foresee steady growth. We see opportunities to leverage our core competencies in stencils, screens, and blades by adding total solutions-based services.
phoenix|x-ray Systems+Services
Tony Williams, regional sales manager, East CoastTechnological innovation and close customer partnerships were 2007’s key points. We received the Florida Governor’s Business Award for product excellence and innovation. In 2007, we have been in close cooperation with EMS companies developing zero-defect inspection technologies, from submicron X-ray CT to AXI. We’ll build and nurture strategic partnerships with forward-thinking customers in 2008. With GE Sensing & Inspection Technologies, Inc., we’ll partner for next-generation products and services.
Panasonic Factory Solutions Company of America (PFSA)
Atsuto (Alex) Shimada, presidentPFSA built on 2006 growth in high-volume markets for momentum in 2007. We expanded market reach by introducing products and solutions to manufacturers of all sizes. We opened our Advanced Packaging Laboratory in Buffalo Grove, Ill., as well. Overall equipment effectiveness (OEE) is key to satisfying diverse customers. We will offer more customized, proactive approaches to manufacturing productivity, quality, and profit in 2008.
P.D. Circuits
David Wolff, presidentIn 2007, P.D. Circuits experienced growth due to greater market awareness of our PCB supply chain management ability. Staffing grew in our U.S. and China offices. We improved our MIS capabilities for customer support, installing a secure VPN to our China office and enhancing our ERP system’s efficiency, data analysis, and productivity. In China, we expanded capabilities to include HDI, and our inspection staff earned IPC600 certification. Military business will rise in 2008. We will move to a larger facility in China by yearend.
OK International
Tom Seratti, VP global sales & marketingOK International introduced soldering, rework, and dispensing product lines in 2007, and expanded our global footprint. We created a presence in emerging parts of Asia and Europe. Globalization strategies have changed, with the local market becoming a priority. Maintaining revenue and earnings growth will be a challenge in 2008, and only those businesses that resolutely commit to differentiating will be able to escape the downward spiral of commoditization in a global economy.
Ovation Products
Charlie Moncavage, GMGood times in 2007 from a revenue standpoint. Due to new product development and improvements to existing products, there also were some high costs. We became established in the European market and penetrated the Asian market. In 2008, Ovation will see benefits from our 2007 product investments. We expect the North American market to grow, and will seek success in Europe and Asia. We’ll also contribute to emerging green technologies.
Omron Electronics LLC
Gregg Holst, president and COOOmron is changing from an AOI hardware provider to an AOI solution provider with software packages that reduce the time and cost of manufacturing PCBs. Our 2008 software products aim to reduce the initial AOI program creation time; reduce false call errors; identify the root cause of failures by inspecting at multiple points and analyzing images; and minimize training and travel costs with remote teaching.
Nextreme
Paul Magill, Ph.D., VP sales & marketingNextreme experienced business and personnel growth in 2007. Seri Lee, Ph.D., joined as CTO and is an expert in system-level thermal management. Phil Deane, Ph.D., advanced packaging specialist, joined as senior research scientist. We released a thin-film thermoelectric device that produces a 60°C differential while pumping 150 W/cm2. Volume manufacturing ramps in January 2008. Thermal issues are coming to the fore in all markets. Nextreme integrated thermal functionality into a flip chip solder bump.
Nihon Superior Co. Ltd.
Tetsuro Nishimura, presidentA 2007 highlight was releasing our high-reliability lead-free flux-cored solder wire SN100C (030) under the e-Core brand. The proprietary Sn/Cu/Ni/Ge lead-free SN100C alloy was selected for new consortia projects on lead-free soldering. We plan to build on product recognition to develop greater market share. We will bring SN100C to the global electronics manufacturing industry through participation in conferences and industry projects in 2008.
MMC Consulting
Michael L. MartelThe U.S. electronics manufacturing market is transitioning. For quality, reliability, and security reasons, some products cannot be outsourced to Asia. High-mix/low-volume, mom-and-pop EMS companies will grow larger and drive the resurgence of U.S. electronics manufacturing, also fueled by new packaging technologies, costly stacked devices, and difficult-to-assemble parts. Look also for the unexpected. We will see a return of the skilled operator on automatic and semi-automatic equipment.
Milara Incorporated
Steve Brodeur, program director, printer divisionIn 2007, Milara introduced the AWPb 300 automated wafer bumping system for the semiconductor market and the SemiTouch STAV system for SMT. We finalized internal expansion plans to create a 4,000-sq.m. Europe facility, which will be solar-powered. We’ll also release our inline stencil printer. Milara will invest in wafer printing applications and volumetric printing in BGA substrates in 2008.
MicroCare Corp.
Christopher A. Jones, president2007 brought numerous lead-free products online, and added capabilities for our factory. The challenge for 2008 and beyond is long-term - safe, effective, and affordable cleaning alternatives. While eliminating ozone-depleting solvents was difficult, that battle pales in comparison to global warming’s complexities. We will deploy environmentally progressive answers in 2008, balancing complicated health, safety, logistical, economic, and regulatory requirements. REACH in Europe and CARB rules in Calif. are two examples of game-changing legislation to which our industry must adjust. Can it be done? Absolutely.
Mentor Graphics Corporation
John Isaac, director of market development, Systems Design DivisionOur customers continue to face significant increases in PCB design complexity, compounded by pressures to decrease time-to-market, use people and manufacturing resources spread around the globe, and implement advanced PCB fabrication technologies and IC/FPGA components. We’ll invest R&D resources to keep ahead of these customer demands in 2008. These investments will focus not only on technology within the PCB design domain, but also on improving efficiency in the product realization process, through inter-disciplined collaboration across design and manufacturing organizations.
Manncorp, Inc.
Henry Mann, CEOWhile 2007 was just an OK year, it’s setting the table for great expectations of 2008. Marketplace-driven design updates included mid-range pick-and-place systems that are faster, smarter, and simpler; lead-free reflow and wave solder machines with smaller footprints; energy-efficient wave systems using less solder, and lead-free rework systems that remove and replace BGAs and micro-BGAs automatically. Growth also will materialize from expansion in India and Eastern Europe.
Kyzen
Tom Forsythe, VP2007 brought growth, particularly in Asia; many staff and partners joined the team globally, improving our understanding of customer requirements and R&D. Customers adopted new technology at a rapid rate. In 2008, we foresee facility and footprint expansions; new product introductions for assembly, stencils, packaging, and maintenance; and cleaning R&D and technical papers. We’ll actively support and participate in technical associations.
KIC, Brian O’Leary
North American sales managerWe expanded R&D’s senior staff, leading to products ranging from a cost-effective automatic profiling system to a software-based system that reduces reflow and wave systems’ electricity consumption. 2008 will be a growth year, picking up a key trend in automation. Lower costs, thin thermal margins with lead-free, and emphasis on quality all require more automation. A second major industry trend is lower energy use. The expense of energy will drive development for efficient equipment and processes. KIC introduced a product that selects ideal oven setups, minimizing energy use for an in-spec process.
Kester
Peter Biocca, technical and key accounts manager2007 saw a global increase in lead-free solder use, mostly SAC. Interest in Kester’s K100LD tin/copper-based solder increased. Industries exempt from RoHS - medical, automotive, and telecom - began looking to lead-free. Kester, under ITW, realigned operations for an intimate approach to product development and support. Our new Itasca, Ill., facility includes modern assembly equipment and our Mexico location optimized operations. We expect growth in North American markets, particularly Mexico; and in Asia, particularly China. The transition to lead-free assembly continues, with conversions in all regions increasing by about 10%.
Juki Automation
Bob Black, president and CEOJuki grew more than 30% in the Americas and globally in 2007, recording its best year for business. In 2008, we anticipate strong growth in market share through debuts of several machines. Next year, we’ll build on momentum experienced in 2007 and expect growth from the products targeting the manufacturing community’s needs.
IPC
Anna Garrido, director, marketing & communicationsIPC began work on revisions to “Acceptability of Electronics Assemblies” and “Requirements for Soldered Electrical and Electronic Assemblies.” J-STD-004, covering flux, will be released early in 2008. Members predict more fine and ultra-fine pitch. SMEMA is working on a better view of the installed equipment base, as well as customers’ demands, and enhancing APEX. IPC Solder Products Value Council is engaged in a research program on take action limits (TALs). Also known as dump pot specifications, TAL are important to electronics manufacturers using flow soldering in selective or wave. The Council’s objective is to develop better defined limits to guide electronics manufacturers on efficient solder use and improved yields.
Inovaxe
Bob Douglas, presidentWe added major enhancements to inventory control solutions, including inventory control software for each INOCART. We upgraded INOKIT software, particularly for traceability, and introduced the INOCART-MSD, a material handling system to manage moisture-sensitive devices. We foresee brand recognition and product acceptance in 2008, and domestic and international growth.
Inovar Inc.
Jed Jones, VP sales & marketingInovar has been referred to as the “Marines of contract manufacturing.” 2007 brought revenue growth, additional personnel, and facility expansion to double in size. We acquired IWI Global, a safety company, to add engineering services and fulfillment. In 2008, we will see price/margin pressure. The need for efficient execution has never been greater. We’ve installed programs and processes to be effective on a global basis.
iNEMI
Jim McElroy, CEOOur 2008 aim will be to satisfy members’ needs for industry collaboration. We will be developing the next roadmap edition with an emphasis on broader international participation and scope. Additional iNEMI resources in China and Europe will facilitate regional initiatives that meet local needs and leverage skills. Major thrust areas are miniaturization, medical electronics, and energy and the environment. In the environmental area, industry will collaboratively develop responsible, proactive responses rather than just reacting to regulations. A good example is our effort to stimulate the supply base for more complete solutions for halogen-free materials systems, which impacts many plastics used in electronics.
Icon Technologies
Simon Leow, GMIn 2007, orders grew by 50% and machines upgrade options developed by ICON were offered to our existing customer base. Prospects for 2008 include key markets like Vietnam, and introducing development projects to include market-specific platforms: 3D chipsets and advanced technology for the cell-phone market.
Heraeus Incorporated,
Brian Bauer, sales manager for the AmericasIn 2007, we integrated Welco Fine Powders, adding wafer bumping and other fine-solder-powder products for 01005s. We purchased PSP, adding solder spheres down to 40 μm. We’re committed to the U.S. market, and will expand in South America. Mexico/South America will be key growth engines in 2008. We’ll open a plant with advanced equipment and techniques, following “six sigma” principles.
The electronics group of Henkel
Patrick Trippel, presidentIn 2007, we acquired Accurus Scientific Company, Ltd., integrating advanced solder spheres into our portfolio and adding a Yantai, China plant. Second-generation lead-free materials and an Amine-based underfill launched. To support India’s growing electronics market, we established a solder paste blending facility. Integration will move from PCB to package, as with SiP and PoP, reducing the number of components required. Newer-generation Cornerbond and Edgebond underfill processes will gain momentum in 2008 for lead-free.
Genesis Electronics Manufacturing, Inc.
Scott Mauldin, presidentIn 2007, medical device business lead overall market growth; representing 30% of our manufacturing business. Our electronic repair & service depot grew in volume and services. LCD repairs exceeded 15,000 units and wireless and networking products repaired and refurbished increased significantly. In 2008, medical and government sectors will grow. Our field service manufacturing initiative will offer customers an alternative to last-time buy demands.
FINETECH
Neil O’Brien, director, U.S. salesIn 2007, Finetech focused on total solutions, targeting process-specific solutions for complex, high-value rework. Software is available with a complete profile library for lead-free and tin/lead SMT components. In 2008, we will develop rework processes for high-density boards, especially in the small-module and handheld product markets. Challenges include fine-pitch component printing, QFN, PoP, CSP/BGA reballing, and underfilled components.
Exerra, Inc.,
Ian Fleck, GMExerra Inc. moved into a 4,000-sq.ft. facility in 2007. We installed two demonstration units to show our capability in printing small components. We installed more than 10 systems in North America, and created a service infrastructure for installations and customer support. In 2008, we will rely on our core technology. With smaller components becoming the norm, six-sigma printing capability from a cast-iron structure, granite board support, and digitally encoded servo-motor drives enhances repeatability.
EVS International
Simon G. Norman, director of international salesIn 2007, the electronics world switched to ISO 14001 environmental management. The industry is pursuing efficiency, effectiveness, and cost reduction by improving productivity and processes. Solder is at an all-time high cost due to “dirty” producers losing production and global pollution concerns. Lead-free solder is at a 200-300% premium over tin/lead. In 2008, we’ll globally launch a smaller solder recovery unit: the EVS 1000.
Europlacer
John Perrotta, VP of North AmericaEuroplacer released the IINEO platform in 2007, after completing alpha and beta testing of the flexible automatic SMT assembler. We released an inventory tracking system that enables real-time WIP-material management and adapts to ERP systems. This aims at inefficiencies in high-changeover environments, particularly partially used reels, lost or misplaced reels. I expect continued sales growth in North America.
Essemtec AG
Martin Ziehbrunner, CEOIn 2007, growth was generated from high demand for turnkey solutions and flexible pick-and-place systems. The market for reflow ovens remained high, despite the fact the most Europe-based companies invested in 2006 for the RoHS conversion. We introduced automatic and inline stencil printers and a range of automatic dispensing systems for various applications. Essemtec India opened for direct sales and service support. In 2008, we predict growth. The focus on highly flexible production machines allows us to offer equipment to North America and Europe.
Endicott Interconnect Technologies, Inc.
James J. McNamara, president and CEOEI grew in 2007 as we diversified our business base - working toward qualifications and proper certifications to penetrate new market segments, such as medical, and solidify our position in the military, defense, and aerospace markets. We anticipate sustained revenue growth in 2008 as we expand market segment diversification.
Electrolube
Scott Wells, U.S. sales managerElectrolube saw significant U.S. growth following marketing work, distributor support, and product launches. We released WBPs, a pre-blended water-based sprayable conformal coating; PCS, a synthetic-based masking material; and RST, a surface modifier designed to enable cleaning resin spills. We launched a VOC-free coating at Productronica. Growth plans throughout the whole of the NAFTA market are key.
Elcoteq Network S.A.
Carsten Barth, director, corporate strategy and global marketingElcoteq focused on EMS communications technology with greater design and DfM involvement. Business expansion and wins in Asia, Eastern Europe, and China combined with reducing high-cost operations. Global compliance was met for standards imposed by RoHS, WEEE, and China RoHS. Our 2008 focus is an integrated EMS (IEMS) strategy, using acquisitions/alliances/partnerships to increase EMS service levels. 2007’s programs also will continue. Implementing a box-build, systems integration, modular approach to computer networking products and systems will reduce price and increase quality and time-to-market.
Ekra America
Steve Hall, president2007 was our best year for printing solutions sales to the Americas’ SMT and hybrid markets. EKRA completed a transition with five major printer platform releases and additional feature and option releases. Products included high-speed post-print inspection systems. In 2008, we see another strong year with improved customer support.
Dynatech/Samsung
Mike Foster, GMSamsung’s knowledge of electronics manufacturing, combined with an aggressive product development strategy, resulted in the SM series of machines. Our SM feeders added inventory tracking as part of the IT feeder system. The industry response to these systems was positive in 2007. We’ve moved to a new factory to support business growth. The overall industry will remain healthy; we’re planning several 2008 product launches.
Dow Corning Corp.
George Toskey, global market managerIn 2007, we collaborated with customers to reduce the number of assembly steps in price-sensitive consumer devices. We launched optical encapsulants that help high-power LEDs replace less-efficient lights. We developed an adhesive that reduces the energy budget for cure operations. We invested in manufacturing capabilities for polycrystalline silicon, targeting the solar industry. In 2008, we will support customers’ drive to control energy costs and improve productivity. We are strengthening local support capabilities globally.
DEK International
John Hartner, CEO; executive VP, Dover TechnologiesIn 2007, DEK’s alternative energies program expanded with an additional cleanroom for screens manufacturing for fuel cell and photovoltaic cell production. We opened a next-generation manufacturing facility in Shenzhen and introduced the Europa RTC printer with a 4-sec. cycle time. Through “DEKollege,” we invested in employee training. 2008 brings DEK’s 40th anniversary, and will include expanding our Electroform stencil technology production in Singapore and R&D investments in alternative energies. We’ll expand in India and Vietnam.
Dage Precision Industries
Paul Walter, managing directorDage worked with customers to solve inspection-and-test needs, offering 2.0-megapixel imaging, 9,200× magnification, and 250-nm feature recognition on our X-ray systems. We introduced a large-format X-ray system and advanced CT inspection systems to slice through multiple layers for 3D modeling and volumetric measurement of critical solder interconnections. We will maintain R&D investments in 2008.
CyberOptics Corporation
Steve DiMarco, VP sales and marketingCyberOptics continued to grow its SMT inspection business in 2007 with added products and functionality. We increased the SE 300 Ultra solder paste inspection systems’ speed for high-speed SMT lines, and enhanced our user interface and SPC capabilities. We introduced a Flex Ultra HR high-resolution AOI system targeting 01005s and 0201s. In 2008, we expect market growth for inspection systems to outpace overall growth in SMT capital equipment.
Creative Automation Company
Gary Helmers, VP, dispensing divisionCreative Automation focused on applications that require precision at small volumes in 2007. We achieved single-dot volumes down to 0.25 nl. Small-volume/high-accuracy dispensing is in demand. We will introduce two machines in 2008. The first will make nano-dispensing more cost-effective; the second is a conveyorized machine with placement accuracy to 5 μm, using next-generation and mature motion-control software.
Cookson Electronics
Bruce Moloznik, VP global marketingIn 2007, we have observed a diminished pace of lead-free conversion. We expect conversion will continue in 2008, but at a slower pace. Cookson focuses development in high-volume CSP assemblies, PoP applications, photovoltaic solar cells, and nano-metal materials. In 2008, we anticipate continued volatility of key raw material prices. We enhanced regional R&D, manufacturing, and applications support in the Asia-Pacific, opening a 32,000-sq.ft. R&D office in Bangalore. We’ll add an applications laboratory in Shanghai. In the Americas and Europe, the focus is yield and throughput.
COMET North America
Bill Diamond, presidentWith the lead-free transition, it will not just be SMT parts that require X-ray, but also interconnections and mechanical parts. In 2007, COMET acquired YXLON International, establishing Comet in non-destructive testing based on X-ray technology. With ever-increasing use of hidden solder joints, along with miniaturization and increased complexity, we expect more non-destructive X-ray inspection. We’ll focus on ease-of-use in 2008, with features like QuickScan for fast CT image retrieval, FGUI 3.0 software interface to simplify automation of inspection routines, and modular system designs for faster changeover.
Celestica
Pete Tomaiuolo, director, corporate technologyMany companies experienced the first growing pains of lead-free manufacturing. From a supply perspective, price premiums and a pinch in the availability of non-RoHS-compliant parts, particularly BGAs, were issues for products in temporary or exempt markets. We expect that this issue will possibly worsen. Companies making high-complexity products must act now to meet the 2010 deadline for RoHS conversion. Product complexity may require different manufacturing technologies, like vapor phase reflow. Celestica will build on our environmental leadership for this group.
BTU International, Inc.
Paul J. van der Wansem, chairman and CEOIn 2007, BTU focused on our key markets. We introduced products that optimize overall cost of ownership. In alternative energies, we focused on products for manufacturing silicon-based and thin-film photovoltaic cells. BTU introduced in-line solutions for diffusion and metallization processes. In 2008, we anticipate growth and increased electronics-assembly market share. In photovoltaics, we plan NPIs and strategic partnerships. Many key customers are implementing aggressive expansion plans for 2008.
BPM Microsystems
Lyman Brown, executive VP and COOIn 2007, we focused on launching our Flashstream technology to companies manufacturing electronic products with flash memory. In 2008, global demand for OEM automotive electronics will grow. Quality MCU programming will be key for safety, entertainment, and communication systems. BPM’s broad-complex MCU programming support targets these challenges.
Blue Thunder Technologies
Claudio Orefice, presidentThis past year has been active and exciting. We increased our product lines by adding companies such as Multicore, Vision Engineering, and JBC. In 2008, Blue Thunder is expanding its sales force and support personnel. New products from High-Tech Conversions will influence our consumables sector. High-Tech will launch three products in January 2008 under Blue Thunder.
Balver Zinn
Paul Salmon, business development managerThis year was successful across our solders, specialty wires and anodes, and related products. Despite good growth in lead-free solders, tin/lead remains significant. In 2008, we’ll launch a paste form of Nihon Superior’s SN100C. Through acquiring Cobar, we’ve expanded sales and distribution globally. We plan to move Balver Zinn’s chemistry side to Breda. We expect the business climate to be slower in 2008 compared to 2007.
AVX
Craig Hunter, strategic marketing managerDeveloping markets are voraciously adopting low-cost versions of popular electronic products, while existing markets are moving upscale. As examples, 2007 saw the debut of the Apple iPhone with touchpad control and strong branding. At AVX, we saw the need for higher performance devices like very-low-inductance capacitors, low-ESR capacitors, and product developments like directional couplers - all important to high-end phones. TV phones will generate significant demand for all of these.
ASYS Inc.
Markus Wilkens, GMIn 2007, we strengthened our U.S. market position by penetrating telecommunication, automotive, and medical industry sectors. We managed integrated projects by combining depaneling, marking, handling, and end-of-line automation products. In 2008, we will open a second office on the West Coast. We’ll launch a board-handling line in 2008, open a Singapore manufacturing facility, and add 50,000 sq.ft. of manufacturing space in Germany. We also see expanding in industries related to electronics manufacturing as a way to stay competitive.
Asymtek
Alec Babiarz, president, new business developmentAsymtek’s SMT dispensing business expanded in secondary underfill applications for consumer products. Driving applications for conformal coating were automotive and white goods. We received Intel’s Supplier Continuous Quality Improvement (SCQI) award. We forecast industry growth with increased capacity in handheld devices and desktop/laptop computers in 2008. DDR3 and DDR4 memory devices will incorporate more flip chip, increasing demand for jet underfill. Asymtek plans product launches through NEPCON China 2008.
Aqueous Technologies
Mike Konrad, presidentWe experienced moderate growth in 2007, due to international expansion. Engaging regions such as China, Russia, and Western Europe led to increased revenues and market share; we established a European sales and service center. Accelerated international growth rates mandate equipment more suitable for international operation. In 2007, Aqueous introduced Trident, an automated defluxing system designed for use in all countries with all local power sources. Trident’s interface is regionally configurable based on language. We expect growth in Asian and European markets in 2008. Aqueous will expand its presence in specific local markets. North America should produce modest growth, dominated by Asia and Europe.
Agilent Technologies
NK Chari, marketing manager, measurement systems divisionAsia will continue to fuel much of the anticipated growth in the EMS industry. Consolidation will mean a tighter market where EMT vendors need to provide cost-effective solutions. The trend of increasing usage of high-speed differential signaling with shrinking components and rising node counts will persist. We plan to create technology differentiators that help manufacturers gain faster and better test access and defects coverage, while providing better ROIC.
Aegis Industrial Software Corporation
Jason Spera, cofounder and CEO2007 was a year of change. Growth in Europe brought a new managing director and European headquarters. Our operations in Asia grew rapidly, particularly in Japan. North America’s new headquarters building was completed in 2007. We invested in Version 7 release, and will enter 2008 with a new corporate infrastructure and MES product version, which is our focus for 2008. Version 7 is designed to improve traceability and factory control within the MES system. Integration between Aegis’ factory information systems and ERP became a significant part of our business.
5-Trees LLC
Krista Botsford, analystWe were involved with industry activities focused on environmental compliance (standards, lobbying, education), and created working partnerships in various areas of the supply chain (testing, training, documentation) in 2007. We moved headquarters to N.H. In 2008, we’ll open our first international office with a European focus. With a software partner, we plan to release software for eco-compliance tracking. Greater exposure is necessary in emerging environmental areas, such as medical devices, monitoring equipment, electric/electronic controls, and industrial equipment. We’ll add partners in recycling/waste management for electronics.