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Productronica Product Preview
December 31, 1969 |Estimated reading time: 6 minutes
Following are products and services debuting or being demonstrated at Productronica, November 1316 in Munich, Germany. AOI systems, reflow ovens, probe testers, cleaning solutions, placement systems, and other tools will be introduced by Mydata, Agilent, CyberOptics, Europlacer, Viscom, Essemtec, YESTech, atg Luther & Maelzer, High-Tech Conversions, Smart Sonic, Electrolube, and Finetech.
Agilent Technologies Inc. will unveil the Agilent Medalist sj5000 AOI solution for post-reflow inspection. It is built on a flexible platform; uses a linear gantry developed with Anorad, a division of Rockwell Automation; features a simplified conveyor and clamping design; and boasts skins providing easier maintenance access. It is capable of inspecting 01005 components. Hall A1, Booth 576.
atg Luther & Maelzer GmbH will launch the A5-A probe system with automation for small manufacturing facilities. It incorporates next-generation automation to accommodate different PCB types and sizes quickly. A flexible, stress-free loading and uploading system, with a sensitive handling function, eliminates operator intervention. The probe tester uses four high-resolution CCD cameras for optical scanning. Hall B4, Booth 341.
Viscom will release its S3088-II AOI system. The inspection system is designed for high-throughput environments. It features advanced Viscom 8M camera technology. Hall A2, Booth 377.
Essemtec will introduce its RO-VARIO reflow oven for soldering and curing. Multiple different jobs can run in parallel, and multiple transport and support rails can be installed in parallel. A select-and-lock system enables automatic positioning of each rail. One motor drive is required for a complete group of air fans (upper/lower). Other features include reportedly accurate regulation of zone temperature, water cooling, nitrogen inert atmosphere, flux management, and a proprietary air guidance system. The temperature profile can be programmed and regulated to tight limits. RO-VARIO also features RO-CONTROL software.
Essemtec also plans to release HLX8100, a high-performance placement system for flexible SMT manufacturing, at the show. It suits production environments with small/single-piece volumes, large product variety, or frequent product changes. It features 192- × 8-mm feeder capacity, intelligent programmable feeders, and processing speeds up to 11,250 CPH. An alternative model, HLX8200, features two heads and accommodates speeds up to 22,000 CPH. Linear motors and fixed PCB positioning increase precision, along with a Cognex Vision (SMD4) system. Essemtec also will highlight its SP003-MLV semiautomatic stencil printer with vision, SP900 in-line printer, SP600-USC batch printer with shuttle system, CSM7100V flexible pick-and-place system with intelligent feeders and vision, and CDS6700 dispenser with a new piezo flow valve for solder paste dispensing. Booths A5-277 and A5-278.
YESTech plans to showcase its YTV F-Series AOI system, with Fusion Lighting, for high-volume or high-mix manufacturing environments. Fusion Lighting and advanced image processing technology integrate color, normalized correlation, and rule-base algorithms for complete inspection coverage with a low false failure rate. Off-line programming and real-time SPC monitoring reportedly enhance yields. YESTech will also highlight its B3 AOI system with next-generation advanced image processing on a benchtop format. The B3 is available with two top-down viewing Thin Cameras to inspect 01005s. The YTV B3 and F-Series are effective for paste, pre-/post-reflow, and final assembly inspection. Hall 5, Booth 455.
High-Tech Conversions Inc. will feature FREE-SAT presaturated wipes for Class 1000 (M4.5) and higher applications. Comprising 70% isopropyl alcohol/30% deionized (DI) water, the wipes feature low lint and nonvolatile residue, and low static charge. NOVA-TECH 1000 material is nonwoven, a blend of absorbent cellulose reinforced with polyester fibers. High-Tech Conversions also will display its GREEN MONSTER ESD stencil wiping roll and Aquavator stencil wiping fabric. Hall A4, Booth 420.
Smart Sonic will exhibit the closed-loop filtration (CLF) stencil cleaners, which reportedly clean all solder-paste types without discharging any waste to drain. Two independent filtration systems recirculate the wash and rinse for reuse. The rinse filtration system includes DI water. CLF stencil cleaners may be used with all types of stencil cleaner chemistries; however, when used with the company's 440-R SMT detergent, the CLF system will be closed loop and VOC free. Hall A4, Booth 203.
Mydata's MY500 jet print systemMydata will launch its Synergy Line, with two MY12 machines and one MY500 operating in a fully automated line. The line features automatic conveyor width adjustment, automatic program selection on the MY500 and MY12, and automatic setup of loader and unloader. It simultaneously handles boards with different widths from different batches. Changeovers are made on the fly triggered by the barcode on PCB cassettes. Both the MY500 and the MY12 programs are automatically loaded when the first board in a batch enters the machine. Mydata also plans to highlight its Agilis stick magazine (ASM), and focus on the MY500 jet printing technology. Hall A5, Booth 337.
Europlacer will demonstrate its Xpress 25 flexible high-volume SMT placement system, combining high-speed and fine-pitch capabilities. It has twin heads to place an array of devices from 0201s to 50- × 50-mm QFPs at a 0.144-sec. tact time, 25,000 CPH). The system is equipped with smart nozzles, intelligent feeders, and on the fly vision. Xpress 25 has an accuracy of 0.06 mm (QFP) to 0.1 mm (chip) at 4 sigma. Europlacer also will demonstrate its iineo pick-and-place system and Flexys-10 intelligent placement system. Hall A4, Booth 125.
CyberOptics Corporation will exhibit Process Insight statistical process control (SPC) software based on an enterprise-level database and open computing standards. The software is a common interface for SE 300 Ultra and Flex Ultra HR data analysis and correlation. It features chart-specific alarms on out-of-control data and trends, and data output from an SQL database for connection into shop floor control software. Features include greater capability for integrating data between SE 300 SPI and Flex AOI, enhanced charts for improved yield analysis, display of SE 300 defect images, moving average trending, and lot code charting. Process Insight can pre-schedule reports; tools access and manage all system data for historical analysis. The company also will highlight its SE 300 Ultra 3D solder paste inspection system and Flex Ultra high-resolution AOI system. Hall A4, Booth A4.262 with GPS Technologies.
Electrolube will launch FSC, a flexible, fast-drying silicone-based conformal coating for PCBs exposed to high humidity. It adheres to various substrates and fluoresces under UV light for inspection. Operating temperature is -50° to +125°C. The product contains no isocyanÂates so it can be soldered without producing toxic gases. Electrolube also will launch a non-VOC conformal coating, and will feature Resin Stop coating and PCS peelable mask. Hall A3, Booth 171.
Finetech will debut its video microscope workstation, FINEVIEW, for inspection and analysis of small PCBs and components. It suits defect diagnostics, monitoring of rework results, or repair-by-hand applications. The system includes top camera, TFT screen, LED lighting, clamping support, laser pointer, and multi-function control panel. It offers up to 25× motorized zoom magnification, and auto- or manual focus, with reduced surface reflections. The company will launch its LED lighting solutions for vision alignment and process observation on FINEPLACER systems. Compared to standard halogen lighting, LED technology is said to be energy efficient, have reduced heat dissipation, provide better luminance values, and last longer. LED lighting 2×2 or 4×4 is recommended when working on large field or high magnification. LED lighting equipment is optional for the video module, VARIO/ VARIOPlus, and the side camera. Finetech also will premier its infrared start sensor for contactless board temperature measurement: no in-process handling is needed during the process due to contactless infrared measurement and a laser pointer. The infrared start sensor is characterised ±5°C profile reliability. Benefits include reportedly increased peak temperature accuracy and reduced thermal stress. Hall A3, Booth 375.