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AT&S Specifies Enthone Dry Film Resist
October 18, 2007 |Estimated reading time: 1 minute
LANGENFELD, Germany AT&S Austria Technologie & Systemtechnik AG selected the PHOTEC H-9825 dry film resist, manufactured by Hitachi Chemical and custom slit and distributed by Enthone, for volume PCB manufacturing at its Hinterberg, Austria, facility. The PCB maker will continue implementing the dry film resist at its Asia-Pacific facilities in 2008.
The multifunctional resist technology is engineered for fine-line circuitry down to 25-µm thick. Its tenting capability targets high density, fine-line space requirements. Enthone and AT&S have collaborated for more than 10 years, said Thomas Schlinger, commodity manager of AT&S global procurement, adding that technical knowledge and high product performance won the contract during evaluation.
AT&S also is evaluating PHOTEC DL-1000 laser-imaging dry film for 355- and 405-nm applications. The resist offers fast-exposure photosensitivity, a wider operating window, and beneficial adhesion and resolution characteristics, according to AT&S. PHOTEC dry film photoresists are manufactured by Hitachi Chemical Company, Ltd., Japan and exclusively marketed and distributed in Europe by Enthone. The materials company custom slits the dry film rolls at its ISO:14001-certified Netherlands facility.
For more information on AT&S, visit www.ats.net, or visit Enthone's Website, www.enthone.com.