-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Henkel Names Technical Manager
October 16, 2007 |Estimated reading time: Less than a minute
IRVINE, Calif. Henkel Corporation promoted Renzhe Zhao, Ph.D., to technical manager of applications engineering, responsible for defining and supervising product development in stacked-die, underfill, and small molded package applications at the company's Calif. Technical Center. He will also oversee materials development in die-attach liquids, solder spheres, and tacky fluxes.
Zhao joined Henkel upon completion of his post-graduate studies five years ago. He helped the company's applications engineering team establish package-level underfill testing procedures, and was lead engineer on Henkel's Hysol QMI718 die attach. He contributed to the Hysol FP4581 flip-chip material, and other flip-chip and power-package products. Zhao will report to George Carson, technical director of applications engineering.
With a bachelor's and master's from Tianjin University (China), Zhao conducted post-graduate studies at Auburn University (Ala.), earning a master's and Ph.D.
For more information, visit www.henkel.com/electronics.