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Dow Debuts Encapsulants for HB-LEDs
October 16, 2007 |Estimated reading time: Less than a minute
MIDLAND, Mich. Dow Corning Corp. introduced a range of silicone encapsulants for high-brightness LEDs (HB-LEDs), featuring low moisture absorption, improved heat dissipation, and high transparency with a refractive index of 1.53. The three formulas target various hardness and viscosity needs.
The encapsulants resist heat, chemical, and ultraviolet (UV) light damage, and allow HB-LEDs higher light output due to their high refractive index (HRI). The OE-665 A and B two-part formula offers high hardness and low viscosity. The OE-6630 is softer, with an equally low viscosity. The OE-6635, also a two-part formula, is softer and features higher viscosity.
An HB-LEDSilicone encapsulants withstand higher operating temperatures than traditional epoxies, and are compatible with lead-free reflow processes, reports Dow Corning. The HB-LED encapsulation market represents a high-growth opportunity for the company, explained Billy Han, global market manager for LED and light-management products. Dow built the range of silicone encapsulants to suit various substrates and assembly processes involving LEDs.
For more information, see www.dowcorning.com/electronics.