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Unitemp Mini Reflow for R&D, NPI
October 5, 2007 |Estimated reading time: Less than a minute
PFAFFENHOFEN, Germany Unitemp released the RSS series of mini reflow soldering systems, with optional vacuum or gas atmospheres for R&D, prototyping, and small-series production. The machines feature controlled ramp and cool-down rates, and heat up to 450°C.
The RSS-350 line heats to 350°C and is available with 110- × 110-mm (RSS-350-110) or 160- × 160-mm heated area (RSS-350-160). The RSS-450 line offers the same dimensions with ramp up to 450°C. All of the reflow ovens can be equipped with external vacuum up to 10-mbar (torr) pressure, and formic acid or hydrogen gas modules.
The process chamber includes a viewing window, and an external controller stores temperature profiles and allows programming of up to 16 steps. Flow metering is manually adjusted. Ramp up can be performed at up to 120°C/min.; cool down can hit 180°C/min.
The systems suit laboratory R&D flux-less soldering, flip-chip processing, adhesive bonding, hermetic sealing, power-device soldering, housing assembly and environmental research, prototyping, and small-series production. They also can be used for process development and quality control in packaging and assembly.