-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Ironwood Debuts Fine-pitch BGA Socket
October 5, 2007 |Estimated reading time: Less than a minute
BURNSVILLE, Minn. Ironwood Electronics introduced a high-performance BGA ZIF socket for 0.4-mm-pitch BGAs. It is designed for a Shinko 12-mm form factor, and reportedly requires little board real estate.
The socket operates at up to 10-GHz bandwidth with less than 1 dB insertion loss. It dissipates up to several watts without additional heatsinking, and handles up to 100 W with a custom heatsink. It comprises reportedly high-performance/low-inductance elastomer. Board space is required for two mounting screws, and chip clearance equals 2.5-mm so discrete components can be placed around the IC. The socket accommodates 12-mm BGAs with 28 × 28 arrays and 515 balls.
Pin inductance measures 10.15 nH; capacitance to ground is 0.10 pF. Contact resistance typically equals 23 mΩ/pin. Operating temperature ranges from -35° to +100°C. For more information, see www.ironwoodelectronics.com.