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Products
December 31, 1969 |Estimated reading time: 11 minutes
Following are products from some companies exhibiting at Productronica, November 13-16, 2007, Munich, Germany.
Surfactant-based Cleaning Agents
Fast Acting Surfactant Technology (FAST) based cleaning agents are a proprietary mix of surfactants that remove lead-free and eutectic flux residues. FAST agents reportedly provide shorter contact times and require less active ingredients to remove contaminants. The solid-free formula leaves no residues on substrate surfaces or in equipment. ZESTRON, www.zestron.com. Hall A4, Booth 316.
AOI and X-ray Systems
A series of in-line and bench-top AOI and X-ray yield enhancement systems featuring proprietary Fusion lightning technology can inspect components down to 01005s on boards up to 450 x 500 mm. The systems perform detailed, algorithm, color, and matching checks for solder presence, flow, bridging, and lifted pads. YESTech, www.yestech.com. Hall A5, Booth 455.
Third-generation XRF
NITON XL3 XRF instruments are fast, accurate analytical tools for complying with EU and China RoHS, WEEE, and other regulations. The handheld XL3t features a 50-kV, 2-W X-ray tube, and offers higher-speed and lower-element detection limits to screen incoming components. Thermo Fisher Scientific, www.thermo.com. Hall A2, Booth 434.
High-throughput, Concurrent ICT
TestStation Duo is a high-throughput, concurrent ICT for high-volume PCBA manufacturers. The unit combines two test modules in a single tester frame, allowing simultaneous PCB testing. All features of the TestStation family are offered, including SafeTest protection technologies, UltraPin II driver/sensors, and FrameScan FX vectorless test methods. Teradyne, www.teradyne.com. Hall A1, Booth 335.
Printing and Dispensing Products
The MPM Momentum printer enables high-speed post-print inspection and rapid changeover. The Camalot FX-D dispenser reportedly features flexibility and low cost of ownership. Its plug-and-play design enables field reconfiguration with any option. The Camalot XyflexPro+ joins the FX-D system, and will be demonstrated with the patent-pending SmartStream pump, featuring non-contact streaming technology. Speedline Technologies, www.speedlinetech.com. Hall A4, Booth 161.
Stencil-cleaning Detergent
For manual cleaning of SMT stencils and related tooling, 440-R SMT Detergent is verified for specific parameters of environmental and user safety, and cleaning efficiency by the U.S. EPA’s Environmental Technology Verification Program. The water-soluble detergent reportedly improves print production, contains no VOCs, and eliminates noxious odors. SMT Detergent Corp., www.smtdetergent.com. Hall A4, Booth 203.
Ultrasonic Stencil Cleaner
An ultrasonic stencil cleaner has been verified for specific parameters of environmental and user safety, as well as cleaning efficiency by the U.S. EPA’s Environmental Technology Verification Program. It combines ultrasonic technology with an aqueous cleaning chemistry for efficient, VOC-free cleaning. Smart Sonic Corporation, www.smartsonic.com. Hall A4, Booth 203.
Process Control Tool
ScanINSPECT VPI process tool qualifies each step of the assembly-and-fabrication process prior to production. The stand-alone system combines a high-resolution, color-flatbed scanner with a dual-lighting system to verify process components before reaching the line. The tool is said to validate design; board fabrication; bare board, stencil, and component inspection; deposition and component mounting; and finished board scanning. ScanCAD, www.scancad.com. Hall B5, Booth 120.
Dual-conveyor Placement Machine
The Siplace X4i placement machine operates with a dual conveyor and four 20-nozzle heads for a range of applications and line concepts. Combining hardware, software, and process improvements, the system can place 110,000 CPH. Board-size capabilities range from 250- x 380 mm. The Siplace X4i also features i-Placement, which enables two placement heads to run in parallel. i-Placement is also said to shorten the travel paths of gantry and head. Siemens Energy & Automation, www.usa.siemens.com. Hall A5, Booth 177.
AXI System
The microme|x high-resolution AXI system suits failure analysis in semiconductor and electronics industries. The system is equipped with a 180-kV X-ray tube for sub-micron feature recognition at <1 µm, and a high-resolution 2-Mpixel digital image chain with 16-bit image processing . Its software targets manual and AXI for a range of components. Phoenix|x-ray, www.phoenix-xray.com. Hall A2, Booth 277.
Dummy Components
Several dummy components, including Amkor’s package-on-package (PoP - PSvfBGA); Amkor thin substrate micro leadfreame-TAPP (tsMLF); a sub-100-μm flip-chip test die; and redesigned Cookson, Indium, and AIM Print Test Board and Kits will be showcased. All products are supported by the 2007 catalog. Practical Components, www.practicalcomponents.com. Hall A4, Booth 480 (AAT Aston GmbH booth).
Non-contact Metrology System
OGP QuickView 220 is a large-format non-contact dimensional measurement system for high-volume operations. With a granite base and column passive vibration-isolation system, non-contact stage encoders, and linear motors, the system offers inspection and mean time between failure (MTBF). The dual-magnification metrology system uses two cameras for quick magnification changes. Optical Gaging Products, www.ogpmesstechnik.de. Hall A2, Booth 166.
Convection-air Pre-heater
The PCT-100 is a focus pre-heater for enhanced process control during lead-free hand assembly and rework. The tool uses convection air heating for tin/lead and lead-free solders, delivering a stable pre-heat to perform assembly tasks at peak temperature without board distortion. Controlled slope eliminates thermal shock, while the unit ramps to temperature. OK International, www.okinternational.com. Hall A3, Booth 542.
High-mix Feeder
The MYDATA Agilis Stick Magazine (ASM) eliminates vibratory stick feeder issues, while reducing set-up and changeover times. The MY500 allows for off-line preparation. Jet printing also enables placement of large components closer to smaller ones for higher-density PCBs. A MYDATA Synergy line encompasses two MY-12 machines and one MY500. MYDATA automation, www.mydata.com. Hall A5, Booth 337.
AOI and SPI Systems
Supra M AOI System configured with Flying Color is configurable for 2 or 3D inspection. Equipped with iPro Software, the system gives users high-performance inspection capabilities of rule-based systems. Modeled on the high-performance AutoInspector series, the Tabletop GEM Compact with True Color Electro-optics allows similar capabilities in a smaller footprint. Machine Vision Products, www.mvp.dpc.com. Hall A2, Booth 352.
SMT Dispenser
The Non-contact Metering (NCM) dispenser features a Piezo-electric-driven valve capable of ejecting hundreds of drops/sec, and works with SMT glue, UV-curable encapsulants, and underfills. When interfaced with a MiniMax system, an adhesive process can reach +40,000 dph. The TMax tabletop dispense system features a work area of 406 x 508 x 152 mm. GPD Global, www.gpdglobal.com. Hall A4, Booth 141.
Aqueous Cleaning Technologies
AQUANOX A4625 aqueous chemistry for lead-free residues has a long tank life for multiple-pass applications. It runs at low concentrations and temperatures. The biodegradable, low-VOC solution is compatible with all materials used in manufacturing and cleaning processes. A4625B is a non-flammable, non-corrosive liquid cleaner that removes nearly 300 soldering materials. Kyzen Corp., www.kyzen.com. Hall A4, Booth 126.
Compact Thermal Profiler
The compact KIC Explorer thermal profiler combines SMT technology with high-temperature-rated components, and can endure harsh conditions. The system features 12 thermocouples and a miniature-TC harness design. It is available in a standard Type-K, 7-channel model and can provide high sampling rates, increased memory capacity, and data precision. KIC, www.kicthermal.com. Hall A4, Booth 134.
Lead-free Solder Paste
Indium5.1AT lead-free solder paste offers low voiding at via-in-pad, good printability and wettability, and a robust reflow profile window. The paste delivers voiding in the 5% range when soldering BGAs with via-in-pad technology. It accommodates various board sizes, densities, and throughput requirements. The paste is formulated to minimize the impact of downtime. Indium Corporation, www.indium.com. Hall H4, Booth 163.
CSP Underfill
Loctite 3536 is said to improve reliability for advanced CSP and BGA packages. Designed to fill the space beneath these packages, the material cures rapidly at low temperatures, minimizing thermal stress to other components. When fully cured, the underfill protects solder joints from mechanical stress. The electronics group of Henkel, www.us.henkel.com. Hall A3, Booth 159.
Compact X-ray Inspection Series
The compact JewelBox 90T and 70T real-time X-ray inspection series lets users examine internal solder joints and bonds in BGAs, microBGAs, flip chips, ICs, and other complex components. The systems identify solder voids, insufficient reflow, or cracks in 1-mil wires. All systems are said to offer geometric magnification up to 500X and electronic magnification up to 2,000X. Five-axes manipulation enables full 360° rotation and 45° tilt. Glenbrook Technologies, www.glenbrooktech.com. Hall A5, Booth 445.
Coatings
Resin Stop coating uses fluoropolymer technology coats machines, jigs, molds, and other substrates of aluminum, stainless steel, glass, and plastics. It provides a dry film that prevents most epoxy and polyurethane resins from adhering. The resin can be peeled off once fully cured. PCS is a water-based environmentally friendly peel-able coating mask that changes color once cured. Electrolube, ww.electrolube.com. Hall A3, Booth 171.
Printer Platforms
The eP33 printer combines mono-block casting and a two-stage, servo-driven granite table with a digital, servo-controlled drive system on every axis. Integral 2D&D Print Quality Inspection, a triple-section PCB transport system, and programmable squeegee-pressure control with continuous in-process monitoring let assemblers manage each printing step. Any shape on the stencil or PCB can be used as a fiducia. Exerra, www.exerra-na.com. Hall A4, Booth 480.
Solder Recovery System
The compact, lightweight EVS 1000 solder recovery system converts waste dross into pure solder, providing a cleaner wave with less maintenance, downtime, and reduced shorts and bridging. The 10-lb./5-kg-capacity system eliminates the use of wave oils and dross-reduction powders, and is suitable for small/medium users with one to three wave solder machines. EVS International, www.solderrecovery.com. Hall A3, Stand 544.
Dispensing Tools
Optimum-engineered dispensing components are said to boost quality while reducing waste, rework, and process variations. Syringe barrels provide laminar of watery, low-viscosity fluids to thicken viscous materials during filling and dispensing processes. The barrels use an internal geometry to eliminate “dead spots.” EFD, www.efd-inc.com. Hall A4, Booth 430.
Printing Products
Offered on the Europa RTC system, Reel-to-Reel technology is said to enhance the performance of continuous flexible substrate manufacturing. The Europa RTC will demonstrate its four-second cycle times. DEK, www.dek.com. Hall A4, Booth 305.
X-ray Inspection and CT Systems
The XiDAT XD7600NT digital X-ray inspection system is equipped with 250-nm feature recognition, 2D inspection capability, and computerized tomography (CT) for 3D modeling and volumetric measurement. The XiDAT XD7500VR digital X-ray inspection system features oblique-angle viewing and 950-nm feature recognition. The 4000HS High-speed Bondtester and 4000 Multi-purpose Bondtester detect brittle fracture failures. Dage Precision Industries, www.dage-group.com. Hall A2, Stand 161.
X-ray Solutions
Offered under the YXLON brand, the Y.COUGAR PRO offers an automatic loading solution for larger-volume X-ray inspection. Y.QUICK SCAN reportedly achieves high-resolution µCT scans in <1 min.; the Y.FGUI 3.0 GUI features a full-size X-ray image said to ensure minimal resolution loss. ICOMET GmbH, www.comet.ch. Hall A2, Booth 349.
Lead-free Solder Paste
ALPHA OM-350 solder paste with InnoLot alloy can withstand harsh thermal cycling and vibrations, making it suitable for under-hood applications. Reportedly a “technology enabler,” the InnoLot alloy reliably performs up to 150°C in challenging vibratory conditions, and responds well in thermal cycling-to-fail tests compared to standard SAC alloys. Cookson Electronics, www.cooksonelectronics.com. Hall A4, Booth 245.
Automated Precision Engineering Systems
Cluso Automated Precision Engineering (APE) systems integrate and automate documentation control, first-article inspection, and QA records and archiving. The systems reportedly reduce SMT line set-up, improves inspection results, and achieve traceability at no additional costs. The systems feature Automatic Desk-check of CAD data, BOM and pick-and-place data, screen-viewable discrepancies. Cluso Vision Systems, www.clusovision.com. Hall A2, Booth 437.
NOR and NAND Programming System
The Flashstream Vector Programming System, a four-socket manual device, is equipped with a proprietary Vector Engine, offering flash programming of NAND or NOR. Vector Engine uses a co-processor design to accelerate flash memory waveforms. Faster speeds are achieved using synchronous operations that eliminate dead times when a DUT waits on the programmer. For memories up to 32 Gb, the system has an upgradeable RAM. BPM Microsystems, www.bpmmicro.com. Hall A4, Booth 380.
Corner- and Edge-bond Dispenser
DispenseJet DJ-9000 jet for corner and edge bonding offers an alternative to underfilling for BGA and CSPs. The system is said to improve speeds. Calibrated process jetting reportedly ensures that the correct volume of adhesive is jetted; data logging of process parameters can ensure high-yield production. Adhesives are jetted onto the PCB in dots at the corner of BGA attachment points before chip placement. Asymtek, www.asymtek.com. Hall A4, Booth 340.
Versatile Pick-and-Place Platforms
The M-Series reportedly offers fast, accurate, versatile placement for medium and large batches with complex component mixes. The MG-1 and MG-8 are said to eliminate placement defects using a 3D co-planarity camera with side view. The self-calibrating systems also feature optional Force Control and are self-maintaining. Assembléon, www.assembleon.com. Hall A4, Booth 179.
Pick-and-Place Equipment
The L-series Pick-and-Place systems are equipped with 8-mm tape-bank feeders. L60 has 144 8-mm tape lanes, and features speed and accuracy enhancements. Targeting low- to mid-volume SMT assembly, the systems have linear encoders and place 0201s and 15-mil-pitch components. Placement rates reach 4,600 CPH for PCBs up to 13.5” x 32”. APS NOVASTAR LLC, www.apsgold.com. Hall A3, Booth 426.
Test-and-Inspection Solutions
A post-reflow AOI platform designed for flexibility and ease-of-use will be unveiled. The Medalist x6000, a 3D in-line AXI; Medalist i1000 ICT solution; MXZ-1000 fully integrated WiMAX calibration and tuning test solution for high-speed testing; and the TS-5030 automotive functional test system are showcased. The Medalist test-and-inspection family covers SPI, AOI, AXI, and ICT, system software, repair environments, process measurement tools, and QC tools. Agilent Technologies, www.agilent.com. Hall A1, Booth 576.
Factory-floor Control Software
Data Miner solves data analysis and fulfillment demands; MES User Portal with full redesign of the factory-floor user environment offers improved speed and feedback; User-configurable Real-time Dashboard System uses drag-and-drop functionality to build custom, real-time line, factory, or machine dashboards. xTend business system integration technology Aegis Version 7 delivers real-time, historical analytics and business intelligence. Aegis Industrial Solutions, www.aiscorp.com. Hall A5, Booth 101. For more Productronica products, visit www.smtonline.com.