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Henkel Appoints Todd V.P. of PD&E
December 31, 1969 |Estimated reading time: Less than a minute
(Sept. 4, 2007) IRVINE, Calif. Michael Todd, Ph.D., was promoted to the position of vice president of product development and engineering for semiconductor and assemblies technology at Henkel.
For several years, Todd has overseen product development strategies for the Irvine-based team as they manufactured mold compound, die attach, wafer-level underfill, and chip-scale packaging underfill materials. As vice president, he will expand his duties to oversee product roadmaps at the company's Yantai, China; Linyangong, China; Tainan, Taiwan; and Hemel Hempstead, U.K. facilities.
Henkel plans to continue next-generation die-attach material development, including dicing die attach films, mold advanced, and new underfill systems to handle the challenges of stacked and bare-die attachment. "...It is a very exciting time at Henkel right now," said Todd.