-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Pan Pac Seeks Presenters
August 28, 2007 |Estimated reading time: Less than a minute
There are currently six spots available for speakers to present at SMTA's 13th Annual Pan Pacific Symposium, to be held January 22-24, 2008, in Kauai, Hawaii.
SMTA seeks papers on packaging, interconnection, business issues, markets, assembly, and microsystems technology. Interested parties can submit their 500-word abstracts with title and author contact information at www.smta.org, or via e-mail to joann@smta.org. The submission deadline is Friday, September 7, 2007.
Pan Pac promotes international technical interchange and provides a forum for networking among microelectronics professionals and business leaders throughout the Pacific Basin.