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Solder Products Value Council Studies Take Action Limits
August 27, 2007 |Estimated reading time: 1 minute
BANNOCKBURN, Ill. The IPC Solder Products Value Council (SPVC) has taken on its next project Take Action Limits (TAL) also known as dump-pot specifications. The project goal is to develop well-defined limits to guide manufacturers on efficient solder use for improved yields.
Headed by Karl F. Seelig, vice president of technology at AIM, Inc., and IPC SPVC chairman; and Paul Lotosky, director customer technical support at Cookson Electronics, and IPC SPVC Technical Committee chairman, the group will evaluate the effects of impurity limits on lead-free performance through wetting time and wetting-force tests. The objective of these tests is to provide consistent recommendations for action levels on contaminate of wave soldering alloys. Test samples will also be sent to a third-party test facility to determine if there is a relationship between bridging and copper concentration.
The council plans to publish its findings and list TAL, as well as guidelines for solder-pot management early next year. "This is an excellent example of how the global solder suppliers are working together to help improve the soldering process for the electronics assembly industry," noted Lotosky. For more information on the IPC SPVC, contact Tony Hilvers, IPC vice president of industry programs, at Tony Hilvers at IPC.