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Thin-film Epoxy Cures Without Heat
August 23, 2007 |Estimated reading time: Less than a minute
HACKENSACK, N.J. Master Bond Inc. released a low-viscosity transparent epoxy, EP30-4, that cures to components and various substrates without external heat. It cures to a 0.025" or thicker film for conformal coating, potting, adhesive, and sealant uses. The two-component product can be spray or flow dispensed.
It offers an 810-minute working time and cures to a tack-free transparent layer in 30 minutes. Metal, plastic, glass, ceramic, and other substrates provide good adhesion. Non-yellowing characteristics allow optical inspection post-cure.
Electrical insulation resistivity exceeds 1016 Ω/cm; dielectric constant equals 4.3; the epoxy displays a dissipation factor of 0.022 at 100 Hz. It resists water, oil, and most organic solvents and other chemicals. The epoxy withstands operating temperatures between -50° and +120°C.