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Nepcon South China Product Preview
December 31, 1969 |Estimated reading time: 8 minutes
Nepcon South China, August 2831 in Shenzhen, will showcase emerging and flagship products for the Asia assembly market. Following are the materials, inspection systems, production equipment, and additional tools being exhibited at the show.
Blakell Europlacer Ltd. will introduce its Integrated Intelligence Concept, which combines intelligent feeders and placement machines to generate reliable, accurate high-throughput assembly. The Europlacer turret head and machine architecture support intelligent placement. Rotary turret technology reportedly optimizes placement performance independent of feeder-position accuracy. Every feeder is programmable with component and inventory data to streamline setup and changeover. Visit Europlacer at Booth 2G31.
Hitachi High-Technologies(China)Co., Ltd.'s Shenzhen branch will promote its GXH-1S direct-drive modular mounter. The pick-and-place system is designed for increased productivity and reliability. It is said to offer 80,000-CPH throughput with next-generation features. Visit Hitachi at Booth 2G21.
BPM Microsystems will reintroduce its Flashstream flash vector programming system for NAND and NOR flash memory programming at high speeds. A proprietary coprocessor technology, Vector Engine, accelerates flash waveforms during the programming cycle. Synchronous operations reportedly eliminate dead times. With standard 32.7 Gb memory per site, Flashstream features upgradeable RAM for future densities. The programmer also includes a bad-block replacement scheme for NAND and low-voltage support. A four-socket manual system, it can be connected to multiple Flashstream units in concurrent programming mode. BPM Microsystems will also be displaying an automated system at the show. Visit BPM at KAL's Booth 2E21.
Innov-X Systems will offer its Laser-Focus Camera portable X-ray fluorescence (XRF) X-50 system. The handheld XRF offers small-spot testing and displays color images and results for RoHS-compliance documentation. High-powered, the X-50 mobile XRF tests elements down to 1 ppm; alloys to 10 ppm. Visit Innov-X at Booth 1B72.
DEK will launch its 3D Find-a-Part service, an online resource that provides virtual 3-D engineering models for all DEK printer subassemblies, based on CAD models. The service is reportedly highly accurate and suits product and parts verification and ordering. DEK will also highlight its Virtual Panel Tooling (VPT), which enables dozens of substrates to be independently and simultaneously aligned, creating a virtual panel ready for imaging in a single cycle. The company plans to display its legacy ELAi in-line printing platform, flexible HOZ 02i machine, the high-speed/high-accuracy Photon RTC system, and other stencil and printer equipment and process support products. Visit DEK at Booth 2G11.
BTU International, Inc., will showcase its Pyramax 125 solder reflow system with proprietary forced impingement technology. The system offers 24" processing capacity and operating temperatures up to 350°C. A configurable platform allows users to adapt to new process requirements. Pyramax is said to reduce nitrogen consumption with a proprietary flux-management systems, closed-loop heating, and temperature controls. It is qualified for lead-free production. Visit BTU at representative KAL's Booth 2E21 and at representative Gemmy-Tek Technology's Booth 2C48.
ZESTRON Asia/Pacific will exhibit MPC Technology-based cleaning agents, which are said to offer benefits of aqueous and solvent-based cleaners. MPC-based chemistries effectively remove all flux residue types, including rosin-based, lead-free, and no-clean. The products can improve wire-bonding results by defluxing power semiconductor components. They also suit stencil and underside wipe cleaning in printers, removing adhesives and solder pastes. Visit ZESTRON at Booth 2C66.
VJ Electronix will launch its PMT400 rework system, targeting microBGA, BGA, CSP, SMT, MCM, and THT rework. Proprietary Windows-based X-PC advanced process software provides a reportedly simple graphical user interface (GUI) with intuitive programming and Teach Mode profiling. The rework system is lead-free capable, with precision gantry motion, a 1-kW convection heater, and a standard two-zone infrared (IR) bottom heater. Standard features include a six nozzle starter kit, network data management, real-time thermal control, automatic retract optics, and an automated component pick-up nest with component rotation. It handles 0.25-mm components with a 51-mm2 field of view (FOV). Visit VJ Electronix at KAL's Booth 2E21.
Kyzen Corporation will highlight LONOX L5314 water-soluble concentrated cleaning liquid for stencil and wave solder pallet cleaning. The chemistry removes raw solder paste and accumulated flux, and reportedly qualifies to effectively remove about 300 soldering materials. RoHS-compliant, it features pH 10% of 11.012.0, flash point °F/°C none to boiling, VOC Comp. of 0.09 mm/Hg at 20°C, 93°C boiling point and miscible water solubility. Recommended processing is an operating concentration of >25% with an ambient optimum temperature, deionized (DI) water rinse, and air dry. Visit Kyzen at distributor Kaison's Booth 150.
Kester will introduce EnviroMark 918AP, a lead-free, halide-free, air- and nitrogen-reflowable, no-clean solder paste designed for the thermal requirements of lead-free SAC alloys. EM918AP handles fine pitches down to 0.4 mm and is unchanged by idle time, stencil life, or print speed, according to the company. It is resistant to slump, offer quality brick definition, and has stable tack life. Visit Kester at Booth 2F43.
Speedprint Technology Ltd., a division of Blakell Europlacer Group, will exhibit the SP200avi in-line stencil printer, a 23" system designed for medium- and high-throughput, high-mix applications. The system uses proprietary look-down/look-down vision alignment and twin roving cameras mounted on independent X/Y gantries for accurate and repeatable alignment. The paste-on-stencil inspection feature enables users to determine if adequate paste is used pre-print. Selective auto-paste dispense technology is fully programmable. The software incorporates self-diagnostic capabilities, including production logging and automatic fault-report generation. Data stored on the machine may be accessed remotely. Stencil loading is automatic, and the system accepts various stencil frames without adapters. Visit Speedprint at Booth 2G31.
X-Tek Group will launch a camera and detector combination, Impix. The product improves range, accuracy, repeatability, and feature recognition of the Revolution Nanotech X-ray inspection system. It also augments the system's computerized tomography (CT) inspection. Impix is a scientific-grade system with real-time frame rates at full camera resolution and dynamic range. It complements the X-ray machine's Inspect-X image-enhancement software. CT capabilities are improved through the voxel resolution. Visit X-Tek at Booth 1B23f.
ICON Technologies will display the Icon i8 automatic screen printer, designed for high-volume, high-speed production environments. Automation features target higher throughput and minimal operator intervention. Changeover time can be as low as two minutes; product setup time can take less than 10 minutes. The printer delivers a 12-sec. cycle time; 350- × 300-mm, 6.0mm-thickness, or 1-kg maximum board capacity; and print speeds from 2 to 150 mm/sec. Options include a compact auto-tooling system that speeds product changeover, advanced statistical process control (SPC) software, vacuum under-screen cleaner featuring wet and dry functionality in 400- or 520-mm widths, and paste-on-pad solder verification for high-speed inspection. Visit ICON at distributor WKK's Booth 2B01A-C.
Viscom Americas, Inc., will debut the X7056 3-D automatic X-ray inspection (AXI) system to the Asia market. The system incorporates proprietary high-performance microfocus X-ray tubes for 15 µm-per-pixel resolution. Iterative Easy3D software manages image quality. It features parallel top and bottom optical inspection to increase throughput, and the option of AOI cameras to simultaneously inspect and X-ray PCBs. Compatible with other Viscom systems, the X7056 offers optional VPC software, with various filter functions, for process monitoring. Visit Viscom at Booth 1A60.
ESSEMTEC will demonstrate the FLX2010 SMD pick-and-place system. The machine targets high-mix, offering feeder changeover during operation and 5,000 CPH placement speeds. It accepts 0201 and 0.3-mm-pitch components up to 15-mm-high odd forms and 50- × 50-mm BGAs. Laser and vision centering is said to improve accuracy and speed. The integrated feeder-management system recognizes feeders and pickup height automatically. Machine programming can be prepared off-line and optional management information system (MIS) software features stock management, production planning, simulation, and data recording for traceability. The modular design encourages line expansion. Visit ESSEMTEC at Booth 1K05.
FINETECH will highlight its FINEPLACER Pico for advanced rework applications and CRS7 for the demands of the mobile phone rework industry. Visit FINETECH at representative MicroPower Semiconductor's Booth 1A12.
Siemens Electronics Assembly Systems Ltd. will demonstrate its D-series of placement systems. The systems target medium-volume, high-quality, high-mix manufacturing, and incorporate six- and twelve-nozzle heads, as well as Siplace pick-and-place heads for complex, odd-form components. The D2 can output a maximum 31,000 CPH. The D1, depending on head configuration, offers throughput of up to 15,000 CPH. Both machines feature digital vision systems, Siplace software and dual transport, S feeders compatible with legacy platforms, and external Vision Teaching stations. D-series machines place components from 01005s to 10 × 125 mm. Visit Siemens at Booth 2F01.
Mydata Asia Pte. Ltd. will introduce its Agilis Stick Magazine (ASM). The high-mix feeder uses a linear drive and servo-controlled horizontal movement, bar-coded sticks, and non-component-specific feeders, eliminating manual component-feed settings. ASM advances components into pick-up position without vibratory feeding. It targets accuracy, speed, and flexibility with a variety of components. Visit Mydata at Booth 2E33.
CyberOptics Corporation will display its Flex Ultra automated optical inspection (AOI) system. Updated features include a platform with enhanced resolution and faster inspection speeds, 01005 measurement capability (component offset measurement Gage R&R <10 percent), program call-up using barcode reader, and an XML file format output for integration to facility-control systems. It offers proprietary statistical appearance modeling (SAM) to analyze full-color, high-resolution digital images of the PCB. The AOI system can be deployed pre- and post-reflow, post-placement, and post-wave. Mechanical architectures available range from 8" to 18". Visit CyberOptics at representative KAL's Booth 2E21.
JT Electronic Equipment Co., Ltd. will launch several families of reflow and wave soldering equipment. The company is introducing the VS/NS-series reflow ovens, and the NSM-series and KK-3050 wave soldering equipment lines. Visit JT at Booth 2C01.
Rohwedder Group will exhibit its JOT Automation lead-free material handling products, including the J204-54 scanner unit, J210-50 bare-board unstacker, and J204-50 segmented conveyor. The scanner unit is available with 500-mm in-line length for small boards and 1000 mm with optional in-feed conveyor for larger boards. It has a board turn mechanism on the conveyor module. The bare-board unstacker reportedly offers short cycle and set-up times with uninterrupted loading. It is adjustable to suit various board thicknesses. The J204-50 segmented conveyor transports and buffers between process machines with multiple drive technology. There is no contact between boards during transfer. The product group is fully compatible with lead-free production. The company will also demostrate its JOT Automation mobile terminal test boxes and handlers for final assembly. Visit Rohwedder at Booth 1A01.