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IPC Studies Global Development, Microelectronics
August 21, 2007 |Estimated reading time: 1 minute
BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries commissioned in-depth market studies on strategies for global expansion and microelectronics trends and technologies. BPA Consulting (Dorking, Surrey, U.K.) and Prismark Partners (Cold Spring Harbor, N.Y.) will conduct the research. IPC's Executive Market Forum oversees the project, and will publish the final reports.
"Where in the World? A Geographic Guide to Investing for Long-term Business Growth in the Electronic Interconnect Industry," compiled by BPA, will provide a primer on economic, social, legislative, educational, logistic, and technical resources for key regions and countries. It will forecast the development path of select areas, scrutinizing infrastructure development, industry capability growth, and investment by industry sector.
Prismark will conduct the research and analysis for "Microelectronics: The Future of Miniaturization and Its Impact on Electronics Manufacturing." It will review technological needs, challenges, and opportunities present in the microelectronics sector; assess drivers toward miniaturization; and cover related end-product trends. Embedded components, high-density interconnects (HDIs), emerging connector types, and other technologies promoted by miniaturization receive analysis and forecasts. Addressing OEM technology roadmap requirements, the report will examine personal computing (PC), hand-held electronics, and telecom/datacom infrastructure equipment end-market industries.
The reports will be available from IPC on November 1, 2007. Authors will present highlights and discussion points at IPC's Executive Market Forum's fall conferences. For more information, contact Sharon Starr at IPC.