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Verdant Names Advisory Board
August 13, 2007 |Estimated reading time: 2 minutes
SUNNYVALE, CA Verdant Electronics named more than 15 members from packaging, interconnect, PCB, and related industries to its board of advisors, including Happy Holden, Werner Engelmaier, and others. These contributors helped frame the Occam package-first assembly method that Verdant recently introduced, and will bring the process from concept to development, said Joe Fjelstad, president, Verdant.
The board comprises:• Paul Benke, with more than 25 years experience in marketing, operations, and executive management in PCB materials, fabrication, and testing industries.• Eric Bogatin, Ph.D., who has held senior engineering and management positions at Bell Labs, Raychem, Sun Microsystems, Ansoft, and Interconnect Devices. • John Burke, an environmentally friendly electronics advocate and founder of Surface Mounted and Related Technologies (SMART) Group in the U.K.• Tom Clifford, with experience in military and aerospace electronics, holds several patents in reliability. Clifford has written on thermal-cycle test, statistical process control (SPC), embedded passives, printed wiring board (PWB) quality control (QC), outsource management, and other topics.• Gordon Davy, Ph.D., who worked to increase reliability in electronics design and manufacturing for more than 30 years at Northrop Grumman. • Werner Engelmaier, president, Engelmaier Associates, Inc., with more than 42 years experience in packaging and interconnect.• Dan Fienberg, president and CEO, Fein-Line Associates, Inc., provides consulting in electronic interconnect and assembly sectors. Feinburg previously served as president, Morton Electronic Materials (MEM Dynachem).• Dennis Fritz, head of the alternate surface finishes committee, IPC; chairman, Jisso North America Committee; member of the Jisso International Council; and section editor, International Roadmap for Electronic Interconnections. • Nader Gamini, with more than 22 years experience in RF and optical package design, operations, quality and reliability, and production test.• Ken Gilleo, Ph.D., with 35 years in electronic circuitry, materials, and packaging. He holds more than 30 patents. • Steve Greathouse, president of Greathouse Solutions, which offers packaging and board-assembly consulting. Formerly with Intel Corporation, Greathouse is a member of the SMTA board of directors.• Belgacem Haba, Ph.D., a Tessera Fellow and the CTO of Advanced Packaging and Interconnect.• Martin Hart, CEO of startup Mirror Semiconductor and president of TopLine Corporation. Hart has 15 years experience with PCB design and chip packaging. • Happy Holden, interconnection technologist at HP until retirement. He currently serves as senior PCB technologist for Mentor Graphics' system-design division.• Harvey Miller, interconnection technology analyst covering interconnection and packaging and assessing technology and business trends and impacts. • Richard Otte, president and CEO of Promex Industries Inc. He previously held the president post at Raychem's Advanced Packaging Systems.• Alan Rae, Ph.D., specializing in technology commercialization and international business. While with Cookson Group plc, he worked with startup and developed businesses, including structural ceramics, flame retardants, refractory materials, electronic ceramics, and wafer-plating systems.• Vern Solberg, SMT expert and SMT advisory board member, with more than 25 years experience in design, manufacturing, and related processes for commercial and aerospace electronic products. • Tony Vacca, an independent consultant and previously senior director of technology development at Silicon Graphics Inc.