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Call for Speakers on Reliability
August 8, 2007 |Estimated reading time: Less than a minute
AUSTIN, Texas IPC and JEDEC are soliciting speakers for the Global Conference on Lead-free Reliability and Reliability Testing for RoHS Lead-free Electronics, December 35 in Austin. Non-commercial papers, tutorials, and workshops will cover design through test-and-inspection, as well as solder alloys, component moisture levels, and modeling.
IPC and JEDEC request abstracts by August 31, 2007, from environmental managers, technical staff, and related industry members. Topics include design for reliability, processing, reliability and harsh environments, and test-and-inspection. Failure-acceleration methods and analysis, product reliability estimation techniques, alloy selection, mixed solder alloys, inspection criteria, and other emerging lead-free themes can be discussed in a 3045-min. presentation, a full-day tutorial, or a half-day workshop. Presentations may be grouped into forums or panel discussions at IPC/JEDEC's discretion.
Interested presenters should e-mail a 200300-word abstract, along with a brief bio, to LFConf@ipc.org. Full-length papers or other presentation materials are encouraged. Proposals should specify the general area of technology test, design, reliability, etc. and the format requested 30- or 45-min. presentation, tutorial, or workshop. IPC/JEDEC will contact accepted speakers by November 1, 2007.
To register for IPC/JEDEC Global Conference on Lead-free Reliability and Reliability Testing for RoHS Lead-free Electronics, e-mail LFConf@ipc.org.