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Solderless PCBAs Use Reverse-order Interconnection
August 1, 2007 |Estimated reading time: 1 minute
SANTA CLARA, Calif. Verdant Electronics will develop a PCB and PCB assembly (PCBA) technique, Occam, that eliminates soldering in favor of an encapsulation and plating process. The reverse-order interconnection process directly connects component terminations with circuit traces, and may eliminate issues with lead-free assembly.
In Verdant's build-up process, fully tested and burned IC packages and other components are placed on a carrier, encapsulated, and plated with copper circuits laser-drilled into the encapsulation. Insulation and circuit layers can be built up from this base to create a functional assembly. All SMT package types can be used in the interconnection process, with or without leads. PCB manufacture and PCBA combines into one continuous step, according to company representatives. The assembly process borrows methodologies from bare-die multichip module assembly developed in the 1990s, said Joe Fjelstad, founder and process developer, Verdant. Reverse-order assembly reduces energy usage and materials consumption, and improves yields, he noted.
Without solder, lead-free and related environmental issues also are circumvented. Finished assemblies are said to be smaller, lighter weight, and more reliable than traditional products. The process could reduce manufacturing costs, and is implemented with existing materials and equipment.
To learn more about the process, attend Verdant's Webcast on the topic, August 16, 1112:30 PST. Visit our Events page for more information.