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Flip Chip Kicks off Seminar Series
July 20, 2007 |Estimated reading time: 1 minute
SHANGHAI, China Universal Instruments will hold a free seminar August 10, 2007, at its Advanced Process Laboratory in Shanghai, focusing on flip-chip assembly processes, materials, and requirements. The seminar is open to customers and all interested parties.
The flip-chip seminar will include a demonstration of the flip-chip process, covering machine setup, material preparation, and pick-and-place assembly. The lecture portion will educate participants on process steps, key concerns for each element, and basic equipment requirements of flip-chip processes. The audience is expected to include application and service engineers from the PCB assembly sector, flux and underfill suppliers, and other industry members interested in participating in flip-chip production. To register, e-mail almiranz@uic.com.
The Advanced Process Laboratory, which opened in April 2007, services Universal's Asia base and international customers that require a specialist locally in China. It provides R&D, knowledge transfer and training, process audits and support, root-cause failure analysis, reliability testing, and prototyping. Universal's Binghamton, N.Y., lab closely collaborates with the Shanghai location. During the seminar, participants will see the lab's automated production line, which uses a Universal high-speed chip-placement system, as well as printer, reflow oven, dispensing equipment, rework-and-repair stations, inspection systems, and other tools. The lab collaborates in research consortia with DEK, Vitronics Soltec, OK International, Tsinghua University, and other partners.
Universal will hold monthly SMT-related seminars for customers and related parties. The sessions will include lectures, demonstrations, and discussion sessions, focused on relationships between materials, production processes, and capital equipment.