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Digi-Key Distributes ATS Heatsinks
July 17, 2007 |Estimated reading time: Less than a minute
NORWOOD, Mass. and THIEF RIVER FALLS, Minn. Advanced Thermal Solutions Inc. (ATS) partnered with Digi-Key, who will offer more than 380 heatsinks for BGA and other high-power device cooling through its print and online catalogs. Design engineers can procure individual ATS heatsinks for prototyping and testing, or larger production volumes.
Digi-Key will market ATS heatsinks, which provide effective cooling, fit an available space, attach properly, and fit within an allowed budget for a range of applications, said Kaveh Azar, president and CEO, ATS. The distribution agreement covers maxiFLOW flared-fin, straight-fin, and cross-cut extruded heatsinks. It also includes devices for cooling Freescale dual-core and LGA processors, ASICs, and linear LED packages. An attach system, the maxiGRIP, ensures secure attachment to flip chips, BGAs, and other components. The system uses a plastic frame clip around the package's perimeter and a stainless steel clip that runs through the heatsink's fin field and fastens to the plastic frame. This product also is available through Digi-Key.