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Cold Bump Pull Enters 2nd Generation
July 10, 2007 |Estimated reading time: Less than a minute
FREMONT, Calif. Dage Precision Industries released the 2nd generation of its enhanced cold bump pull (CBP) capability on the 4000HS high-speed bondtester. An improvement over shear testing, the test load is symmetrical and almost pure tensile, reducing deformation and applying load over the entire bond interface, according to the company.
Loading is said to closely replicate drop testing on corner BGA balls. The second-generation high-speed CBP suits detection of brittle fracture failures in lead-free materials and evaluates the effects of different alloys and pad finishes on solder joint reliability. It reportedly ensures compliance with JEDEC high-speed shear and CBP testing standards.